TSM-114-02-T-DV-A
- Mfr.Part #
- TSM-114-02-T-DV-A
- Manufacturer
- Samtec, Inc.
- Package / Case
- Datasheet
- Download
- Description
- CONN HEADER SMD 28POS 2.54MM
- Stock
- 20,306
- In Stock :
- 20,306
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- Manufacturer :
- Samtec, Inc.
- Product Category :
- Headers, Male Pins
- Factory Lead Time :
- 3 Weeks
- Mixed Contacts :
- No
- Termination :
- Solder
- Lead Free :
- Lead Free
- Contact Length - Mating :
- 0.320 8.13mm
- Packaging :
- Tube
- JESD-609 Code :
- e3
- Contact Shape :
- Square
- Style :
- Board to Board or Cable
- Reach Compliance Code :
- not_compliant
- Insulation Height :
- 0.100 2.54mm
- Number of Positions Loaded :
- All
- DIN Conformance :
- No
- Option :
- GENERAL PURPOSE
- Insulation Material :
- Liquid Crystal Polymer (LCP)
- PCB Contact Row Spacing :
- 4.953 mm
- Contact Finish - Mating :
- Tin
- PCB Contact Pattern :
- RECTANGULAR
- Mating Contact Pitch :
- 0.1 inch
- MIL Conformance :
- No
- Body Depth :
- 0.15 inch
- Series :
- TSM
- Contact Material :
- Phosphor Bronze
- Insulation Color :
- Black
- Gender :
- Male
- RoHS Status :
- ROHS3 Compliant
- Board Mounting Option :
- PEG
- Contact Type :
- Male Pin
- Filter Feature :
- No
- Pbfree Code :
- yes
- Feature :
- Board Guide, Pick and Place
- Body Length or Diameter :
- 1.4 inch
- Operating Temperature :
- -55°C~105°C
- Row Spacing - Mating :
- 0.100 (2.54mm)
- Number of Positions :
- 28
- Shrouding :
- Unshrouded
- Pitch - Mating :
- 0.100 2.54mm
- Total Number of Contacts :
- 28
- Connector Type :
- Header
- Number of Rows :
- 2
- Fastening Type :
- Push-Pull
- Additional Feature :
- E.L.P.
- Published :
- 2016
- Material Flammability Rating :
- UL94 V-0
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- Number Of PCB Rows :
- 2
- IEC Conformance :
- No
- Mounting Type :
- Surface Mount
- Number of Conductors :
- ONE
- Reliability :
- COMMERCIAL
- Datasheets
- TSM-114-02-T-DV-A

TSM Series 2-Row Header Solder Phosphor Bronze Tube Surface Mount Tin Liquid Crystal Polymer (LCP) 28-Position Board to Board or Cable 0.100 2.54mm Height
TSM-114-02-T-DV-A-P Overview
A Header package is included with it.Its mounting type is Surface Mount.Packaging is performed using a Tube case.It is part of the TSM Series of products.Additionally, there are other features, such as E.L.P..A number of features make it more powerful because of its Board Guide, Pick and Place feature.There is no operating temperature for the device.
TSM-114-02-T-DV-A-P Features
TSM series
TSM-114-02-T-DV-A-P Applications
There are a lot of Samtec Inc.
TSM-114-02-T-DV-A-P Rectangular Connectors applications.
- Embedded systems
- Datacom
- Communication
- Medical technology
- Military Technology
- Measuring & Control Technology
- Instrumentation
- Automotive Electronics
- Telecommunications
- Data Technology
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