TSM-113-01-T-DV-A-P
- Mfr.Part #
- TSM-113-01-T-DV-A-P
- Manufacturer
- Samtec, Inc.
- Package / Case
- Datasheet
- Download
- Description
- CONN HEADER SMD 26POS 2.54MM
- Stock
- 2,652
- In Stock :
- 2,652
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- Manufacturer :
- Samtec, Inc.
- Product Category :
- Headers, Male Pins
- Number Of PCB Rows :
- 2
- Termination :
- Solder
- DIN Conformance :
- No
- Fastening Type :
- Push-Pull
- Board Mounting Option :
- PEG
- Style :
- Board to Board or Cable
- Row Spacing - Mating :
- 0.100 (2.54mm)
- Mixed Contacts :
- No
- MIL Conformance :
- No
- Lead Free :
- Lead Free
- Contact Shape :
- Square
- Feature :
- Board Guide, Pick and Place
- Material Flammability Rating :
- UL94 V-0
- Radiation Hardening :
- No
- Pbfree Code :
- yes
- JESD-609 Code :
- e3
- Gender :
- Male
- Mating Contact Pitch :
- 0.1 inch
- Number of Conductors :
- ONE
- RoHS Status :
- ROHS3 Compliant
- Number of Positions Loaded :
- All
- Body Length or Diameter :
- 1.3 inch
- PCB Contact Pattern :
- RECTANGULAR
- Contact Type :
- Male Pin
- Body Depth :
- 0.15 inch
- Operating Temperature :
- -55°C~105°C
- Filter Feature :
- No
- Contact Material :
- Phosphor Bronze
- Mounting Type :
- Surface Mount
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- Total Number of Contacts :
- 26
- Insulation Height :
- 0.100 2.54mm
- Packaging :
- Tube
- Pitch - Mating :
- 0.100 2.54mm
- Option :
- GENERAL PURPOSE
- Insulation Color :
- Black
- Insulation Material :
- Liquid Crystal Polymer (LCP)
- Series :
- TSM
- Additional Feature :
- E.L.P.
- Contact Length - Mating :
- 0.230 5.84mm
- PCB Contact Row Spacing :
- 4.953 mm
- Number of Positions :
- 26
- Shrouding :
- Unshrouded
- Reliability :
- COMMERCIAL
- Contact Finish - Mating :
- Tin
- Factory Lead Time :
- 6 Weeks
- Connector Type :
- Header
- IEC Conformance :
- No
- Number of Rows :
- 2
- Datasheets
- TSM-113-01-T-DV-A-P

TSM Series 2-Row Header Solder Phosphor Bronze Tube Surface Mount Tin Liquid Crystal Polymer (LCP) 26-Position Board to Board or Cable 0.100 2.54mm Height
TSM-113-01-T-DV-A-P Overview
A Header package is included with it.Its mounting type is Surface Mount.Packaging is performed using a Tube case.It is part of the TSM Series of products.Additionally, there are other features, such as E.L.P..A number of features make it more powerful because of its Board Guide, Pick and Place feature.There is no operating temperature for the device.
TSM-113-01-T-DV-A-P Features
TSM series
TSM-113-01-T-DV-A-P Applications
There are a lot of Samtec Inc.
TSM-113-01-T-DV-A-P Rectangular Connectors applications.
- Embedded systems
- Datacom
- Communication
- Medical technology
- Military Technology
- Measuring & Control Technology
- Instrumentation
- Automotive Electronics
- Telecommunications
- Data Technology
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