TSM-109-04-S-DV-A

Manufacturer :

Samtec, Inc.

Product Category :

Headers, Male Pins

Mating Contact Pitch :

0.1 inch

Style :

Board to Board or Cable

PCB Contact Row Spacing :

5.4864 mm

Insulation Color :

Black

Radiation Hardening :

No

Pitch - Mating :

0.100 2.54mm

Mounting Type :

Surface Mount

PCB Contact Pattern :

RECTANGULAR

Mixed Contacts :

No

Row Spacing - Mating :

0.100 (2.54mm)

Contact Material :

Phosphor Bronze

JESD-609 Code :

e3

Body Length or Diameter :

0.9 inch

Reliability :

COMMERCIAL

Contact Finish Thickness - Mating :

30.0μin 0.76μm

Fastening Type :

Push-Pull

Board Mounting Option :

POSITIONING PIN

Connector Type :

Header

Contact Shape :

Square

IEC Conformance :

No

Contact Finish - Mating :

Gold

Number of Rows :

2

Termination :

Solder

MIL Conformance :

No

Feature :

Board Guide

Number of Positions :

18

DIN Conformance :

No

Factory Lead Time :

3 Weeks

HTS Code :

8536.69.40.40

Lead Free :

Lead Free

Packaging :

Tube

Reference Standard :

UL

Number of Positions Loaded :

All

Material Flammability Rating :

UL94 V-0

Number Of PCB Rows :

2

Insulation Height :

0.100 2.54mm

Shrouding :

Unshrouded

ECCN Code :

EAR99

Pbfree Code :

yes

Total Number of Contacts :

18

Option :

GENERAL PURPOSE

Body Depth :

0.1 inch

Gender :

Male

Contact Finish - Post :

Tin

Number of Conductors :

ONE

Contact Type :

Male Pin

Insulation Resistance :

5000000000Ohm

Series :

TSM

Rated Current (Signal) :

3A

Plating Thickness :

30μin

Filter Feature :

No

Operating Temperature :

-55°C~125°C

RoHS Status :

ROHS3 Compliant

Insulation Material :

Liquid Crystal Polymer (LCP)

Additional Feature :

E.L.P.

Contact Length - Mating :

0.120 3.05mm

Dielectric Withstanding Voltage :

1000VAC V