TSM-103-01-G-SV
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- Mfr.Part #
- TSM-103-01-G-SV
- Manufacturer
- Samtec, Inc.
- Package / Case
- Datasheet
- Download
- Description
- CONN HEADER SMD 3POS 2.54MM
- Stock
- 2,018
- In Stock ：
- 2,018
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- Manufacturer :
- Samtec, Inc.
- Product Category :
- Headers, Male Pins
- Radiation Hardening :
- No
- Published :
- 2005
- PCB Contact Pattern :
- STAGGERED
- RoHS Status :
- ROHS3 Compliant
- Connector Type :
- Header
- Additional Feature :
- Tape and Reel
- Mounting Type :
- Surface Mount
- Length :
- 7.62mm
- Total Number of Contacts :
- 3
- Reliability :
- COMMERCIAL
- Factory Lead Time :
- 3 Weeks
- Housing Color :
- Black
- Contact Finish - Mating :
- Gold
- Mount :
- Surface Mount
- Pbfree Code :
- yes
- MIL Conformance :
- No
- Mixed Contacts :
- No
- Number of Conductors :
- ONE
- Contact Material :
- Phosphor Bronze
- Contact Length - Mating :
- 0.230 5.84mm
- JESD-609 Code :
- e4
- Number of Positions Loaded :
- All
- Filter Feature :
- No
- Housing Material :
- Polymer
- Contact Finish Thickness - Post :
- 3.00μin 0.076μm
- Option :
- GENERAL PURPOSE
- Shrouding :
- Unshrouded
- Number of Positions :
- 3
- Termination :
- Solder
- Packaging :
- Tape and Reel (TR)
- Contact Finish Thickness - Mating :
- 10.0μin 0.25μm
- Insulation Height :
- 0.100 2.54mm
- Material Flammability Rating :
- UL94 V-0
- Style :
- Board to Board or Cable
- Contact Shape :
- Square
- Fastening Type :
- Push-Pull
- Contact Type :
- Male Pin
- Pitch - Mating :
- 0.100 2.54mm
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- Max Current Rating :
- 7A
- Gender :
- Male
- Max Voltage Rating (AC) :
- 475V
- Number of Rows :
- 1
- IEC Conformance :
- No
- Series :
- TSM
- Depth :
- 2.54mm
- Insulation Material :
- Liquid Crystal Polymer (LCP)
- Reference Standard :
- UL
- DIN Conformance :
- No
- Orientation :
- Straight
- Operating Temperature :
- -55°C~125°C
- Datasheets
- TSM-103-01-G-SV
TSM Series 1-Row Header Solder Phosphor Bronze Tape & Reel (TR) Surface Mount Gold Liquid Crystal Polymer (LCP) 3-Position Board to Board or Cable 0.100 2.54mm Height
TSM-103-01-G-SV-TR Overview
A Header package is included with it.Its mounting type is Surface Mount.Packaging is performed using a Tape & Reel (TR) case.It is part of the TSM Series of products.Additionally, there are other features, such as TAPE AND REEL.Surface Mount mounts the part.There is no operating temperature for the device.
TSM-103-01-G-SV-TR Features
TSM series
TSM-103-01-G-SV-TR Applications
There are a lot of Samtec Inc.
TSM-103-01-G-SV-TR Rectangular Connectors applications.
- Embedded systems
- Datacom
- Communication
- Medical technology
- Military Technology
- Measuring & Control Technology
- Instrumentation
- Automotive Electronics
- Telecommunications
- Data Technology
You may place an order without registering to Chip IC. We strongly recommend that you log in before purchasing as you can track your order at any time.
RFQ (Request for Quotations)It is recommended to send RFQ to get the latest prices and stock availability about the part.Our sales will reply to your inquiry within 24 hours.
Payment MethodFor your convenience, we accept multiple payment methods in USD, Such as:PayPal, Credit Card, and wire transfer.
IMPORTANT NOTICEYou may place an order without registering to 1. You'll receive an order confirmations by e-mail soon . (Please remember to check the spam box if you didn't hear from us). 2. Since stock availability and prices may change at any time, the sales will reconfirm the order details and update you at soonest time.
Most of our products are shipped via FEDEX,DHL,UPS and SF EXPRESS...
Shipping CostShipping Cost starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.).If customer have shipping account, we can make shipment under customer’s shipping account with freight collect directly.
The basic freight (for package ≤0.5 KG ) depends on the time zones and countries
Once the goods are shipped, estimated delivery time depends on the shipping methods you chose. You can track it by the tracking no.
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