TSI577-10GILV
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- Mfr.Part #
- TSI577-10GILV
- Manufacturer
- Intersil (Renesas Electronics Corporation)
- Package / Case
- BGA
- Datasheet
- Download
- Description
- IC SER RAPIDIO SWITCH 399TEPBGA
- Stock
- 9,624
- In Stock ：
- 9,624
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- Manufacturer :
- Intersil (Renesas Electronics Corporation)
- Product Category :
- Specialized ICs
- Number of Functions :
- 1
- Thickness :
- 1.81mm
- Radiation Hardening :
- No
- Number of Pins :
- 399
- Terminal Form :
- Ball
- Mount :
- Surface Mount
- Length :
- 21mm
- Terminal Finish :
- Tin/Silver/Copper (Sn/Ag/Cu)
- Peak Reflow Temperature (Cel) :
- 260
- Pin Count :
- 399
- Number of Terminations :
- 399
- Lead Free :
- Lead Free
- ECCN Code :
- EAR99
- Pbfree Code :
- yes
- Package / Case :
- BGA
- Terminal Position :
- BOTTOM
- HTS Code :
- 8542.39.00.01
- JESD-609 Code :
- e1
- RoHS Status :
- RoHS Compliant
- Supply Voltage :
- 1.2V
- Factory Lead Time :
- 4 Weeks
- Analog IC - Other Type :
- ANALOG CIRCUIT
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Width :
- 21mm
- Published :
- 2011
- Datasheets
- TSI577-10GILV
Specialized ICs Intersil TSI577-10GILV Overview
The Specialized ICs Intersil TSI577-10GILV is a highly versatile integrated circuit developed by Renesas Electronics Corporation. This product is designed for robust digital data transport and signal integrity in demanding applications. Encapsulated in a Ball Grid Array (BGA) package, it features 399 terminations and operates at a voltage of 1.2V, ensuring compatibility with low-power devices and systems. The TSI577-10GILV is designed for surface mount technology, making it suitable for compact and densely populated electronic assemblies. Its design emphasizes durability and reliability, catering to advanced technological requirements.
Specialized ICs Intersil TSI577-10GILV Key Features
The TSI577-10GILV offers several key features that make it a standout choice for technical and industrial applications:
- 399 high-density I/O pins for versatile connections.
- Operates at a low voltage of 1.2V, optimizing power efficiency.
- BGA packaging for improved thermal management and reduced footprint on PCBs.
- Surface mount compatibility allows for modern PCB assembly techniques.
- Designed to meet the rigorous standards of industrial and telecommunications applications.
Specialized ICs Intersil TSI577-10GILV Applications
The versatile nature of the TSI577-10GILV allows it to be used in a variety of applications:
- Digital signal processing units and complex data systems.
- Telecommunications equipment such as routers and switches.
- Industrial control systems for process automation and monitoring.
- Network infrastructure for secure and reliable data transmission.
- High-performance computing platforms requiring high-speed data transfer.
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