TSI384-133ILV

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Mfr.Part #
TSI384-133ILV
Manufacturer
Intersil (Renesas Electronics Corporation)
Package / Case
256-LBGA
Datasheet
Download
Description
IC INTERFACE SPECIALIZED 256BGA
Stock
2,767
In Stock :
2,767

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Manufacturer :
Intersil (Renesas Electronics Corporation)
Product Category :
Specialized
Supplier Device Package :
256-PBGA (17x17)
Package / Case :
256-LBGA
RoHS Status :
ROHS3 Compliant
Interface :
PCI
Voltage - Supply :
1.2V
Applications :
PCI-to-PCI Bridge
Base Part Number :
TSI384
Mounting Type :
Surface Mount
Factory Lead Time :
20 Weeks
Series :
Tsi384™
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Packaging :
Tray
Datasheets
TSI384-133ILV
Introducing Specialized Intersil (Renesas Electronics Corporation) TSI384-133ILV from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:256-LBGA, Base Part Number:TSI384, Mounting Type:Surface Mount, TSI384-133ILV pinout, TSI384-133ILV datasheet PDF, TSI384-133ILV amp .Beyond Specialized Intersil (Renesas Electronics Corporation) TSI384-133ILV ,we also offer DS90CR285MTDX/NOPB, USB2640I-HZH-02, LTC4316CMS#PBF, Our vast inventory has you covered. Contact us now for immediate solutions.

Intersil (Renesas Electronics Corporation) TSI384-133ILV


Specialized Intersil (Renesas Electronics Corporation) TSI384-133ILV Overview

The Specialized Intersil (Renesas Electronics Corporation) TSI384-133ILV is an advanced IC interface specialized component, housed in a 256BGA package. Designed to meet the demanding requirements of high-speed data processing and communication infrastructures, this IC interface offers robust reliability and superior performance. Its sophisticated design ensures seamless integration into various technological environments, making it an ideal choice for businesses looking to scale their operations through enhanced system capabilities.

TSI384-133ILV Features

The TSI384-133ILV IC interface specialized component comes equipped with high-speed interfacing capabilities, allowing for efficient data transfer and communication across systems. The 256BGA packaging not only provides a compact footprint but also ensures enhanced thermal management, which is crucial for maintaining system stability under high load conditions. Moreover, the chip is designed with robustness in mind, featuring enhanced electrostatic discharge (ESD) protection and a wide range of operational temperatures to suit various industrial applications.

TSI384-133ILV Applications

  • Telecommunications Equipment: Utilizes high-speed data transfer capabilities to enhance communication protocols within network infrastructures.
  • Computing Interfaces: Acts as a core component in motherboards and expansion cards, facilitating faster and more reliable data exchange between computing cores and peripherals.
  • Industrial Automation Systems: Employs robust interfacing features to improve connectivity and data flow in automated manufacturing processes.
  • Medical Imaging Devices: Supports advanced imaging technologies by enabling high-speed processing and data handling for clearer and more accurate medical diagnostics.
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