TSE2004GB2B0NCG8
- Mfr.Part #
- TSE2004GB2B0NCG8
- Manufacturer
- Intersil (Renesas Electronics Corporation)
- Package / Case
- Datasheet
- Download
- Description
- TEMPERATURE SENSOR FOR DDR4
- Stock
- 485,301
- In Stock :
- 485,301
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- Manufacturer :
- Intersil (Renesas Electronics Corporation)
- Product Category :
- Thermal Management
- Supply Voltage-Min (Vsup) :
- 2.2V
- Surface Mount :
- yes
- Lead Free :
- Lead Free
- Pbfree Code :
- yes
- Mounting Feature :
- Surface Mount
- Thickness :
- 750μm
- Length :
- 2mm
- Published :
- 2004
- Termination Type :
- Solder
- Max Operating Temperature :
- 125°C
- Output Interface Type :
- 2-WIRE INTERFACE
- Width :
- 3mm
- ECCN Code :
- EAR99
- Terminal Finish :
- Matte Tin (Sn)
- Sensors/Transducers Type :
- TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL
- Accuracy-Max :
- 3 Cel
- Pin Count :
- 8
- Supply Voltage-Max (Vsup) :
- 3.6V
- Number of Bits :
- 12
- Number of Pins :
- 8
- JESD-609 Code :
- e3
- Factory Lead Time :
- 20 Weeks
- RoHS Status :
- RoHS Compliant
- Min Operating Temperature :
- -40°C
- Datasheets
- TSE2004GB2B0NCG8

Thermal Management Intersil (Renesas Electronics Corporation) TSE2004GB2B0NCG8 Overview
The Thermal Management Intersil (Renesas Electronics Corporation) TSE2004GB2B0NCG8 temperature sensor is specifically designed for DDR4 memory applications, delivering precise temperature monitoring to ensure optimal performance and longevity of memory modules. As DDR4 technology pushes for higher speed and efficiency, maintaining thermal stability becomes crucial. The TSE2004GB2B0NCG8 offers unmatched accuracy and reliability, integrated into a compact, power-efficient package. This sensor is ideal for system designers and engineers looking to enhance system reliability and performance through advanced thermal management.
TSE2004GB2B0NCG8 Features
This state-of-the-art temperature sensor boasts several key features:
- High accuracy and low power consumption suitable for sensitive electronics.
- Designed to interface directly with DDR4 memory modules, enabling real-time temperature monitoring and feedback.
- Compact size, making it easy to integrate into existing and new designs without significant redesign costs.
- Robust reliability under a range of environmental conditions, ensuring consistent performance.
TSE2004GB2B0NCG8 Applications
- DDR4 Memory Modules: Enhances the reliability and performance of DDR4 memory by providing precise temperature monitoring to prevent overheating.
- Servers: Critical for maintaining the operational integrity of server memory banks, ensuring system stability and preventing thermal-induced failures.
- High-Performance Computing: Used in HPC systems where maintaining optimal thermal conditions is crucial for achieving peak performance.
- Portable Computing Devices: Helps in managing the thermal load of memory components in compact devices such as laptops and tablets, extending their operational life and efficiency.
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