TSE2004GB2B0NCG8

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Mfr.Part #
TSE2004GB2B0NCG8
Manufacturer
Intersil (Renesas Electronics Corporation)
Package / Case
Datasheet
Download
Description
TEMPERATURE SENSOR FOR DDR4
Stock
485,301
In Stock :
485,301

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Manufacturer :
Intersil (Renesas Electronics Corporation)
Product Category :
Thermal Management
Supply Voltage-Min (Vsup) :
2.2V
Surface Mount :
yes
Lead Free :
Lead Free
Pbfree Code :
yes
Mounting Feature :
Surface Mount
Thickness :
750μm
Length :
2mm
Published :
2004
Termination Type :
Solder
Max Operating Temperature :
125°C
Output Interface Type :
2-WIRE INTERFACE
Width :
3mm
ECCN Code :
EAR99
Terminal Finish :
Matte Tin (Sn)
Sensors/Transducers Type :
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL
Accuracy-Max :
3 Cel
Pin Count :
8
Supply Voltage-Max (Vsup) :
3.6V
Number of Bits :
12
Number of Pins :
8
JESD-609 Code :
e3
Factory Lead Time :
20 Weeks
RoHS Status :
RoHS Compliant
Min Operating Temperature :
-40°C
Datasheets
TSE2004GB2B0NCG8
Introducing Thermal Management Intersil (Renesas Electronics Corporation) TSE2004GB2B0NCG8 from Chip IC,where excellence meets affordability. This product stands out with its Number of Pins:8, TSE2004GB2B0NCG8 pinout, TSE2004GB2B0NCG8 datasheet PDF, TSE2004GB2B0NCG8 amp .Beyond Thermal Management Intersil (Renesas Electronics Corporation) TSE2004GB2B0NCG8 ,we also offer LTC2991IMS#PBF, DS1629S+, SE97BTP,547, Our vast inventory has you covered. Contact us now for immediate solutions.

Intersil (Renesas Electronics Corporation) TSE2004GB2B0NCG8


Thermal Management Intersil (Renesas Electronics Corporation) TSE2004GB2B0NCG8 Overview

The Thermal Management Intersil (Renesas Electronics Corporation) TSE2004GB2B0NCG8 temperature sensor is specifically designed for DDR4 memory applications, delivering precise temperature monitoring to ensure optimal performance and longevity of memory modules. As DDR4 technology pushes for higher speed and efficiency, maintaining thermal stability becomes crucial. The TSE2004GB2B0NCG8 offers unmatched accuracy and reliability, integrated into a compact, power-efficient package. This sensor is ideal for system designers and engineers looking to enhance system reliability and performance through advanced thermal management.

TSE2004GB2B0NCG8 Features

This state-of-the-art temperature sensor boasts several key features:

  • High accuracy and low power consumption suitable for sensitive electronics.
  • Designed to interface directly with DDR4 memory modules, enabling real-time temperature monitoring and feedback.
  • Compact size, making it easy to integrate into existing and new designs without significant redesign costs.
  • Robust reliability under a range of environmental conditions, ensuring consistent performance.

TSE2004GB2B0NCG8 Applications

  • DDR4 Memory Modules: Enhances the reliability and performance of DDR4 memory by providing precise temperature monitoring to prevent overheating.
  • Servers: Critical for maintaining the operational integrity of server memory banks, ensuring system stability and preventing thermal-induced failures.
  • High-Performance Computing: Used in HPC systems where maintaining optimal thermal conditions is crucial for achieving peak performance.
  • Portable Computing Devices: Helps in managing the thermal load of memory components in compact devices such as laptops and tablets, extending their operational life and efficiency.
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Shipping Method

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Shipping Cost

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The basic freight (for package ≤0.5 KG ) depends on the time zones and countries

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