TSB12LV21BMPGFEP
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- Mfr.Part #
- TSB12LV21BMPGFEP
- Manufacturer
- Texas Instruments
- Package / Case
- 176-LQFP
- Datasheet
- Download
- Description
- IC 3.3V PCI LINK LAYER 176-PQFP
- Stock
- 1,035
- In Stock ：
- 1,035
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- Manufacturer :
- Texas Instruments
- Product Category :
- Controllers
- Peak Reflow Temperature (Cel) :
- 260
- Width :
- 24mm
- Interface :
- Parallel
- Terminal Finish :
- Nickel/Palladium/Gold (Ni/Pd/Au)
- Protocol :
- IEEE 1394
- Packaging :
- Tray
- Data Transfer Rate-Max :
- 50 Mbps
- Thickness :
- 1.4mm
- JESD-609 Code :
- e4
- Height :
- 1.6mm
- Number of Terminations :
- 176
- Terminal Form :
- Gull wing
- Supply Voltage :
- 3.3V
- Low Power Mode :
- No
- Number of Pins :
- 176
- Function :
- Link Layer Controller
- Lead Free :
- Lead Free
- Weight :
- 1.896186g
- Length :
- 24mm
- Voltage - Supply :
- 3.3V
- RoHS Status :
- ROHS3 Compliant
- Package / Case :
- 176-LQFP
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Lifecycle Status :
- ACTIVE (Last Updated: 1 week ago)
- Operating Temperature :
- -55°C~125°C
- Pbfree Code :
- yes
- uPs/uCs/Peripheral ICs Type :
- SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
- Radiation Hardening :
- No
- HTS Code :
- 8542.31.00.01
- Base Part Number :
- TSB12LV21
- Surface Mount :
- yes
- Standards :
- IEEE 1394-1995, 1212-1991
- Bus Compatibility :
- PCI
- Terminal Position :
- QUAD
- Number of DMA Channels :
- 5
- Boundary Scan :
- No
- Terminal Pitch :
- 0.5mm
- Datasheets
- TSB12LV21BMPGFEP
Controllers Texas Instruments TSB12LV21BMPGFEP Overview
The Controllers Texas Instruments TSB12LV21BMPGFEP IC is a specialized component designed to enhance the performance and reliability of PCI-based systems. Engineered by Texas Instruments, this IC is crucial for enabling high-speed data transfer and communication in a wide range of electronic systems. Its robust design ensures compatibility with 3.3V PCI interfaces, making it an indispensable part of advanced digital networking and communication solutions. The integration of this IC into your systems ensures enhanced processing capabilities with improved efficiency and reduced latency, making it ideal for high-demand applications in both commercial and industrial settings.
TSB12LV21BMPGFEP Features
This integrated circuit boasts a plethora of features designed for superior performance in complex electronics. Key attributes include high-speed data handling, compatibility with 3.3V PCI interfaces, and a compact 176-PQFP (Plastic Quad Flat Pack) that ensures a minimal footprint on system boards. These features make the TSB12LV21BMPGFEP a reliable and powerful component for a variety of technological applications.
TSB12LV21BMPGFEP Applications
- High-Speed Networking Devices: Enhances data transmission rates and reliability in routers and switches.
- Video Conferencing Systems: Provides robust data link layers necessary for smooth and continuous video data transmission.
- Advanced Computing Systems: Utilized in PCs and servers to facilitate rapid and efficient communication between system components.
- Embedded Systems: Ideal for integration in specialized industrial machines and devices requiring stable and fast data transfers.
- Telecommunication Infrastructure: Critical in telecommunication equipment for improving link stability and data throughput.
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