TP3064BN

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Mfr.Part #
TP3064BN
Manufacturer
Texas Instruments
Package / Case
20-DIP (0.300, 7.62mm)
Datasheet
Download
Description
IC COMBO CODEC/FILTER 20-DIP
Stock
47,042
In Stock :
47,042

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Manufacturer :
Texas Instruments
Product Category :
CODECS
Sigma Delta :
No
Data Interface :
Serial
Number of Pins :
20
Width :
7.62mm
Number of Terminations :
20
Terminal Pitch :
2.54mm
Mount :
Through Hole
Length :
24.325mm
Packaging :
Tube
Height Seated (Max) :
5.08mm
Voltage - Supply, Digital :
4.75V~5.25V
Type :
PCM, Filter
Companding Law :
MU-LAW
Voltage - Supply, Analog :
4.75V~5.25V
Mounting Type :
Through Hole
Operating Temperature :
0°C~70°C
Neg Supply Voltage-Nom :
-5V
RoHS Status :
ROHS3 Compliant
Max Supply Voltage :
5.25V
Lead Free :
Contains Lead
Package / Case :
20-DIP (0.300, 7.62mm)
Number of ADCs / DACs :
1 / 1
Power Supplies :
+-5V
Number of D/A Converters :
1
Filter :
yes
Terminal Position :
Dual
Min Supply Voltage :
4.75V
Supply Voltage :
5V
Number of Functions :
1
Interface :
2-Wire, Serial
Base Part Number :
TP3064
Moisture Sensitivity Level (MSL) :
1 (Unlimited)
Resolution (Bits) :
8 b
JESD-609 Code :
e4
Terminal Finish :
NICKEL PALLADIUM GOLD
Datasheets
TP3064BN
Introducing CODECS Texas Instruments TP3064BN from Chip IC,where excellence meets affordability. This product stands out with its Number of Pins:20, Number of Terminations:20, Type:PCM, Filter, Mounting Type:Through Hole, Operating Temperature:0°C~70°C, Package / Case:20-DIP (0.300, 7.62mm), Base Part Number:TP3064, TP3064BN pinout, TP3064BN datasheet PDF, TP3064BN amp .Beyond CODECS Texas Instruments TP3064BN ,we also offer CS42L51-CNZ, PCM2906CDBR, PCM2912APJTR, Our vast inventory has you covered. Contact us now for immediate solutions.

Texas Instruments TP3064BN


CODECS Texas Instruments TP3064BN Overview

The TP3064BN from Texas Instruments is a sophisticated IC combo codec/filter integrated into a 20DIP package, engineered to deliver high-quality audio solutions with minimal noise and distortion. This component stands out in the CODECS Texas Instruments TP3064BN category for its robust design and flexibility, making it ideal for applications requiring reliable audio processing and sound enhancement. Designed with advanced technology, the TP3064BN ensures superior performance in a wide range of telecommunication systems. Its integration of codec and filtering capabilities simplifies system design and enhances overall functionality, driving efficiency and reducing costs for bulk purchasers in the B2B sector.

TP3064BN Features

The TP3064BN IC offers several key features that make it a preferred choice for developers and engineers:

  • Dual-function integration: Combines both codec and filter functionalities in one chip, facilitating easier and more compact circuit designs.
  • High fidelity audio performance: Ensures clear and crisp sound quality, ideal for both voice and data communications.
  • Low power consumption: Optimized for energy efficiency, which is critical in portable and remote telecommunications applications.
  • Easy to integrate: Compatible with a wide array of existing systems and technologies, ensuring smooth implementation into various designs.

TP3064BN Applications

  • Telecommunication Systems: Used in telephony infrastructure to improve voice quality by integrating codec and filtering functions directly within the hardware, enhancing both signal integrity and reliability.
  • VoIP Devices: Critical in Voice over IP technologies where clear audio transmission is necessary, the TP3064BN helps in minimizing latency and background noise.
  • Audio Conferencing Equipment: Enhances audio input and output in conference systems, providing clearer communication in business settings.
  • Wireless Communication Devices: Supports wireless devices with robust audio codec capabilities, ensuring clear sound transmission even in variable signal conditions.
This HTML structure provides a detailed and professional description of the TP3064BN, targeted towards B2B customers and highlighting the key aspects and applications of the product.
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