TMS32C6203BGNZA250
- Mfr.Part #
- TMS32C6203BGNZA250
- Manufacturer
- Texas Instruments
- Package / Case
- 352-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FIXED POINT DSP 352-FCBGA
- Stock
- 1
- In Stock :
- 1
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- Manufacturer :
- Texas Instruments
- Product Category :
- DSP (Digital Signal Processors)
- Base Part Number :
- 320C6203
- Mounting Type :
- Surface Mount
- Operating Temperature :
- -40°C~105°C TC
- RAM (words) :
- 524288
- Voltage - I/O :
- 3.30V
- Package / Case :
- 352-BBGA, FCBGA
- Number of DMA Channels :
- 4
- Packaging :
- Tray
- Terminal Finish :
- Tin/Lead (Sn/Pb)
- Width :
- 27mm
- RAM Size :
- 896kB
- RoHS Status :
- Non-RoHS Compliant
- Length :
- 27mm
- Factory Lead Time :
- 12 Weeks
- Internal Bus Architecture :
- Multiple
- Number of Terminations :
- 352
- Number of Pins :
- 352
- Mount :
- Surface Mount
- Interface :
- McBSP
- Lifecycle Status :
- ACTIVE (Last Updated: 4 days ago)
- Voltage - Core :
- 1.50V
- Number of External Interrupts :
- 4
- Terminal Position :
- BOTTOM
- Series :
- TMS320C62x
- ECCN Code :
- 3A991.A.2
- Boundary Scan :
- yes
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- Non-Volatile Memory :
- External
- Supply Voltage :
- 1.5V
- Barrel Shifter :
- No
- Integrated Cache :
- yes
- Operating Supply Voltage :
- 3.3V
- Data Bus Width :
- 16b
- Thickness :
- 2.2mm
- Height :
- 2.8mm
- Radiation Hardening :
- No
- Weight :
- 3.010011g
- JESD-609 Code :
- e0
- Pin Count :
- 352
- HTS Code :
- 8542.31.00.01
- Frequency :
- 250MHz
- Low Power Mode :
- yes
- Peak Reflow Temperature (Cel) :
- 220
- Max Supply Voltage :
- 3.46V
- Number of Timers :
- 2
- Bit Size :
- 32
- Memory Type :
- SRAM
- Additional Feature :
- ALSO REQUIRES 3.3V SUPPLY
- Terminal Form :
- Ball
- Min Supply Voltage :
- 1.43V
- ROM Programmability :
- MROM
- Lead Free :
- Contains Lead
- Type :
- FIXED POINT
- Terminal Pitch :
- 1mm
- Datasheets
- TMS32C6203BGNZA250
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DSP Texas Instruments TMS32C6203BGNZA250 Overview
The TMS32C6203BGNZA250, a premier fixed-point digital signal processor (DSP) from Texas Instruments, embodies the cutting-edge of digital signal processing technology. This device is engineered to handle complex numerical operations required in high-performance digital signal manipulation applications. Its architecture is optimized for speed and efficiency, making it an ideal choice for industries seeking powerful processing capabilities for audio, telecommunications, and digital media applications. The integration of this DSP in your technology stack ensures robust performance and enhanced operational efficiency, aligning with modern demands for quick data processing and high reliability.
TMS32C6203BGNZA250 Features
The TMS32C6203BGNZA250 DSP is packed with features that enhance its utility and performance in demanding applications. It comes housed in a 352-pin FCBGA (Fine-Pitch Ball Grid Array) package that facilitates better thermal management and reduced footprint on PCBs. Key features include high-speed performance metrics, low-power consumption, and substantial on-chip memory, which are essential for applications requiring rapid and efficient signal processing.
TMS32C6203BGNZA250 Applications
- Telecommunications: In telecom systems, the TMS32C6203BGNZA250 enhances data flow management and signal integrity, leading to improved call quality and data transmission reliability.
- Audio Processing: Utilized in audio engineering, from studio recordings to live sound systems, this DSP provides high-fidelity sound processing, minimizing latency and maximizing audio clarity.
- Digital Media: It supports advanced algorithms for media processing, ensuring smooth video streaming and high-quality image processing in various digital media applications.
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