TMS320C6203BGNY30C

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Mfr.Part #
TMS320C6203BGNY30C
Manufacturer
Texas Instruments
Package / Case
BGA
Datasheet
Download
Description
IC FIXED-POINT DSP 384-BGA
Stock
1,588
In Stock :
1,588

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Manufacturer :
Texas Instruments
Product Category :
DSP (Digital Signal Processors)
Thickness :
1.9mm
ROM Programmability :
MROM
Length :
18mm
uPs/uCs/Peripheral ICs Type :
DIGITAL SIGNAL PROCESSOR, OTHER
Number of External Interrupts :
4
Number of DMA Channels :
4
Max Operating Temperature :
90°C
Internal Bus Architecture :
Multiple
Package / Case :
BGA
Format :
FIXED POINT
Peak Reflow Temperature (Cel) :
220
Max Supply Voltage :
3.46V
ECCN Code :
3A001.A.3
Frequency :
300MHz
Number of Terminations :
384
Min Operating Temperature :
0°C
Supply Voltage :
1.5V
Terminal Finish :
Tin/Lead (Sn/Pb)
Moisture Sensitivity Level (MSL) :
4 (72 Hours)
Terminal Position :
BOTTOM
HTS Code :
8542.31.00.01
RAM Size :
896kB
Min Supply Voltage :
1.43V
Data Bus Width :
16b
RAM (words) :
524288
Additional Feature :
ALSO REQUIRES 3.3V SUPPLY
Frequency (Max) :
300MHz
Number of Pins :
384
RoHS Status :
RoHS Compliant
Low Power Mode :
yes
Terminal Pitch :
0.8mm
JESD-609 Code :
e0
Temperature Grade :
Other
Lead Free :
Contains Lead
Number of Timers :
2
Integrated Cache :
yes
Operating Supply Voltage :
3.3V
Barrel Shifter :
No
Terminal Form :
Ball
Mount :
Surface Mount
Height :
2.35mm
Weight :
1.433494g
Qualification Status :
Not Qualified
Pin Count :
384
Lifecycle Status :
NRND (Last Updated: 6 days ago)
Boundary Scan :
yes
Bit Size :
32
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Width :
18mm
Introducing DSP (Digital Signal Processors) Texas Instruments TMS320C6203BGNY30C from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:BGA, Number of Terminations:384, Number of Pins:384, TMS320C6203BGNY30C pinout, TMS320C6203BGNY30C datasheet PDF, TMS320C6203BGNY30C amp .Beyond DSP (Digital Signal Processors) Texas Instruments TMS320C6203BGNY30C ,we also offer TMS320VC5416PGE160, TMS320C6713BZDP300, ADSP-21369KBPZ-3A, Our vast inventory has you covered. Contact us now for immediate solutions.

Texas Instruments TMS320C6203BGNY30C


DSP Texas Instruments TMS320C6203BGNY30C Overview

The DSP Texas Instruments TMS320C6203BGNY30C is a high-performance, fixed-point digital signal processor designed to meet the intensive processing demands of modern embedded applications. This IC is housed in a 384-BGA package, ensuring compact integration and robust reliability. Its exceptional processing capabilities make it an ideal choice for developers aiming to enhance system efficiency and achieve superior performance in signal processing tasks. The TMS320C6203BGNY30C is engineered to handle complex algorithms, enabling rapid data processing and improved functionality in demanding environments.

TMS320C6203BGNY30C Features

The TMS320C6203BGNY30C boasts a variety of features that streamline development and enhance performance. Key features include advanced clock management for optimized power consumption, extensive on-chip memory that facilitates faster data access and processing, and a wide range of integrated peripherals that enhance connectivity and data transfer capabilities. Its high-speed processing core is capable of executing complex signal processing algorithms efficiently, making it highly suitable for applications requiring intensive computational power.

TMS320C6203BGNY30C Applications

  • Telecommunications: Utilized in infrastructure equipment, the TMS320C6203BGNY30C processes vast amounts of digital signal data, improving signal quality and communication reliability.
  • Audio Processing: Integral in advanced audio systems for encoding and decoding digital audio signals, ensuring high-fidelity sound in professional audio equipment.
  • Industrial Control Systems: Enhances the efficiency and reliability of control systems in manufacturing processes through precise and rapid signal processing.
  • Medical Imaging: Applies complex algorithms for real-time processing in medical imaging devices, such as ultrasound and MRI, enhancing image clarity and resolution.
  • Automotive: Supports advanced driver-assistance systems (ADAS) by processing multiple sensor inputs to provide real-time decision-making support.
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