TMS320C6203BGNY30C
- Mfr.Part #
- TMS320C6203BGNY30C
- Manufacturer
- Texas Instruments
- Package / Case
- BGA
- Datasheet
- Download
- Description
- IC FIXED-POINT DSP 384-BGA
- Stock
- 1,588
- In Stock :
- 1,588
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- Manufacturer :
- Texas Instruments
- Product Category :
- DSP (Digital Signal Processors)
- Thickness :
- 1.9mm
- ROM Programmability :
- MROM
- Length :
- 18mm
- uPs/uCs/Peripheral ICs Type :
- DIGITAL SIGNAL PROCESSOR, OTHER
- Number of External Interrupts :
- 4
- Number of DMA Channels :
- 4
- Max Operating Temperature :
- 90°C
- Internal Bus Architecture :
- Multiple
- Package / Case :
- BGA
- Format :
- FIXED POINT
- Peak Reflow Temperature (Cel) :
- 220
- Max Supply Voltage :
- 3.46V
- ECCN Code :
- 3A001.A.3
- Frequency :
- 300MHz
- Number of Terminations :
- 384
- Min Operating Temperature :
- 0°C
- Supply Voltage :
- 1.5V
- Terminal Finish :
- Tin/Lead (Sn/Pb)
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- Terminal Position :
- BOTTOM
- HTS Code :
- 8542.31.00.01
- RAM Size :
- 896kB
- Min Supply Voltage :
- 1.43V
- Data Bus Width :
- 16b
- RAM (words) :
- 524288
- Additional Feature :
- ALSO REQUIRES 3.3V SUPPLY
- Frequency (Max) :
- 300MHz
- Number of Pins :
- 384
- RoHS Status :
- RoHS Compliant
- Low Power Mode :
- yes
- Terminal Pitch :
- 0.8mm
- JESD-609 Code :
- e0
- Temperature Grade :
- Other
- Lead Free :
- Contains Lead
- Number of Timers :
- 2
- Integrated Cache :
- yes
- Operating Supply Voltage :
- 3.3V
- Barrel Shifter :
- No
- Terminal Form :
- Ball
- Mount :
- Surface Mount
- Height :
- 2.35mm
- Weight :
- 1.433494g
- Qualification Status :
- Not Qualified
- Pin Count :
- 384
- Lifecycle Status :
- NRND (Last Updated: 6 days ago)
- Boundary Scan :
- yes
- Bit Size :
- 32
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Width :
- 18mm
- Datasheets
- TMS320C6203BGNY30C

DSP Texas Instruments TMS320C6203BGNY30C Overview
The DSP Texas Instruments TMS320C6203BGNY30C is a high-performance, fixed-point digital signal processor designed to meet the intensive processing demands of modern embedded applications. This IC is housed in a 384-BGA package, ensuring compact integration and robust reliability. Its exceptional processing capabilities make it an ideal choice for developers aiming to enhance system efficiency and achieve superior performance in signal processing tasks. The TMS320C6203BGNY30C is engineered to handle complex algorithms, enabling rapid data processing and improved functionality in demanding environments.
TMS320C6203BGNY30C Features
The TMS320C6203BGNY30C boasts a variety of features that streamline development and enhance performance. Key features include advanced clock management for optimized power consumption, extensive on-chip memory that facilitates faster data access and processing, and a wide range of integrated peripherals that enhance connectivity and data transfer capabilities. Its high-speed processing core is capable of executing complex signal processing algorithms efficiently, making it highly suitable for applications requiring intensive computational power.
TMS320C6203BGNY30C Applications
- Telecommunications: Utilized in infrastructure equipment, the TMS320C6203BGNY30C processes vast amounts of digital signal data, improving signal quality and communication reliability.
- Audio Processing: Integral in advanced audio systems for encoding and decoding digital audio signals, ensuring high-fidelity sound in professional audio equipment.
- Industrial Control Systems: Enhances the efficiency and reliability of control systems in manufacturing processes through precise and rapid signal processing.
- Medical Imaging: Applies complex algorithms for real-time processing in medical imaging devices, such as ultrasound and MRI, enhancing image clarity and resolution.
- Automotive: Supports advanced driver-assistance systems (ADAS) by processing multiple sensor inputs to provide real-time decision-making support.
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