TLP700AF(D4-TP,F)

Manufacturer :

Toshiba Electronic Devices and Storage Corporation

Product Category :

Isolators - Gate Drivers

Thermal Resistance @ Forced Air Flow :

20.39°C/W @ 100 LFM

Diameter :

--

Power Dissipation @ Temperature Rise :

--

Attachment Method :

Push Pin

Pulse Width Distortion (Max) :

50ns

Propagation Delay :

200 ns

Direction :

Unidirectional

Rise / Fall Time (Typ) :

15ns, 8ns

Forward Voltage :

1.7 V

Power Dissipation :

160 mW

Approval Agency :

CQC, CSA, cUL, UL, VDE

Thermal Resistance @ Natural :

--

Height Off Base (Height of Fin) :

0.394 (10.00mm)

Propagation Delay tpLH / tpHL (Max) :

200ns, 200ns

Common Mode Transient Immunity (Min) :

20kV/μs

Current - Peak Output :

2.5A

Max Operating Temperature :

110 °C

Package :

Bulk

Mount :

Surface Mount

Current - DC Forward (If) (Max) :

20 mA

Min Operating Temperature :

-40 °C

Shape :

Square, Fins

Max Power Dissipation :

160 mW

Turn-On Delay Time :

200 ns

Length :

1.772 (45.00mm)

Base Product Number :

TLP700

Number of Pins :

6

Voltage - Output Supply :

15V ~ 30V

Technology :

Optical Coupling

Supplier Device Package :

6-SDIP Gull Wing

RoHS :

Compliant

Type :

Top Mount

Material Finish :

Blue Anodized

Product Status :

Last Time Buy

Material :

Aluminum

Width :

1.772 (45.00mm)

Series :

pushPIN™

Number of Elements :

1

Package Cooled :

Assorted (BGA, LGA, CPU, ASIC...)

Voltage - Isolation :

5000Vrms

Operating Temperature :

-40°C ~ 110°C

Current - Output High, Low :

2.5A, 2.5A

Forward Current :

20 mA

Number of Channels :

1

Voltage - Forward (Vf) (Typ) :

1.55V

Package / Case :

6-SOIC (0.268, 6.80mm Width)

Mounting Type :

Surface Mount

Reverse Breakdown Voltage :

5 V