TLP700AF(D4-TP,F)

Manufacturer :

Toshiba Electronic Devices and Storage Corporation

Product Category :

Isolators - Gate Drivers

Thermal Resistance @ Natural :

--

Supplier Device Package :

6-SDIP Gull Wing

Material :

Aluminum

Length :

1.772 (45.00mm)

Voltage - Isolation :

5000Vrms

RoHS :

Compliant

Current - Peak Output :

2.5A

Material Finish :

Blue Anodized

Approval Agency :

CQC, CSA, cUL, UL, VDE

Mounting Type :

Surface Mount

Thermal Resistance @ Forced Air Flow :

20.39°C/W @ 100 LFM

Shape :

Square, Fins

Direction :

Unidirectional

Voltage - Forward (Vf) (Typ) :

1.55V

Technology :

Optical Coupling

Height Off Base (Height of Fin) :

0.394 (10.00mm)

Base Product Number :

TLP700

Max Power Dissipation :

160 mW

Package :

Bulk

Common Mode Transient Immunity (Min) :

20kV/μs

Max Operating Temperature :

110 °C

Propagation Delay tpLH / tpHL (Max) :

200ns, 200ns

Forward Current :

20 mA

Package Cooled :

Assorted (BGA, LGA, CPU, ASIC...)

Current - DC Forward (If) (Max) :

20 mA

Attachment Method :

Push Pin

Min Operating Temperature :

-40 °C

Reverse Breakdown Voltage :

5 V

Propagation Delay :

200 ns

Forward Voltage :

1.7 V

Power Dissipation @ Temperature Rise :

--

Diameter :

--

Package / Case :

6-SOIC (0.268, 6.80mm Width)

Pulse Width Distortion (Max) :

50ns

Type :

Top Mount

Product Status :

Last Time Buy

Current - Output High, Low :

2.5A, 2.5A

Operating Temperature :

-40°C ~ 110°C

Mount :

Surface Mount

Rise / Fall Time (Typ) :

15ns, 8ns

Power Dissipation :

160 mW

Number of Elements :

1

Series :

pushPIN™

Turn-On Delay Time :

200 ns

Voltage - Output Supply :

15V ~ 30V

Number of Channels :

1

Number of Pins :

6

Width :

1.772 (45.00mm)