TFM-109-02-S-D-DS
- Mfr.Part #
- TFM-109-02-S-D-DS
- Manufacturer
- Samtec, Inc.
- Package / Case
- Datasheet
- Download
- Description
- CONN HEADER SMD 18POS 1.27MM
- Stock
- 41,630
- In Stock :
- 41,630
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- Manufacturer :
- Samtec, Inc.
- Product Category :
- Headers, Male Pins
- Pitch - Mating :
- 0.050 1.27mm
- Number of Positions Loaded :
- All
- Insulation Material :
- Liquid Crystal Polymer (LCP)
- Insulation Color :
- Black
- Series :
- Tiger Eye™ TFM
- Termination :
- Solder
- Contact Material :
- Phosphor Bronze
- Current Rating (Amps) :
- 2.9A per Contact
- Number of Rows :
- 2
- Shrouding :
- Shrouded - 4 Wall
- Contact Finish Thickness - Mating :
- 30.0μin 0.76μm
- Number of Positions :
- 18
- Connector Type :
- Header
- Material Flammability Rating :
- UL94 V-0
- Insulation Height :
- 0.220 5.60mm
- RoHS Status :
- ROHS3 Compliant
- Fastening Type :
- Push-Pull
- Operating Temperature :
- -55°C~125°C
- Packaging :
- Tube
- Factory Lead Time :
- 3 Weeks
- Contact Length - Mating :
- 0.131 3.33mm
- Contact Type :
- Male Pin
- Voltage - Rated :
- 275VAC
- Contact Finish - Mating :
- Gold
- HTS Code :
- 8536.69.40.40
- Feature :
- Mating Flange
- ECCN Code :
- EAR99
- Mounting Type :
- Surface Mount
- Contact Shape :
- Square
- Contact Finish - Post :
- Tin
- Row Spacing - Mating :
- 0.050 (1.27mm)
- Style :
- Board to Board or Cable
- Datasheets
- TFM-109-02-S-D-DS
Tiger Eye™ TFM Series 2-Row Header Solder Phosphor Bronze Tube Surface Mount Gold Liquid Crystal Polymer (LCP) 18-Position Board to Board or Cable 0.220 5.60mm Height
TFM-109-02-S-D-DS Overview
Packaging is in the form of Header.This device has a Surface Mount mounting type.An orange Tube case is used to package the product.Specifically, it is one of the products in the Tiger Eye™ TFM Series.Several benefits come from the Mating Flange feature.Devices operate at -55°C~125°C operating temperatures.
TFM-109-02-S-D-DS Features
Tiger Eye™ TFM series
TFM-109-02-S-D-DS Applications
There are a lot of Samtec Inc.
TFM-109-02-S-D-DS Rectangular Connectors applications.
- Embedded systems
- Datacom
- Communication
- Medical technology
- Military Technology
- Measuring & Control Technology
- Instrumentation
- Automotive Electronics
- Telecommunications
- Data Technology
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