TE0803-02-03EG-1EB
- Mfr.Part #
- TE0803-02-03EG-1EB
- Manufacturer
- Trenz Electronic
- Package / Case
- Datasheet
- Download
- Description
- IC MODULE ZYNQ USCALE 4GB 128MB
- Stock
- 2,096
- In Stock :
- 2,096
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- Manufacturer :
- Trenz Electronic
- Product Category :
- Microcontrollers, Microprocessor, FPGA Modules
- RAM Size :
- 4GB
- Factory Lead Time :
- 12 Weeks
- Module/Board Type :
- MPU Core
- Operating Temperature :
- 0°C~85°C
- Series :
- TE0803
- Connector Type :
- B2B
- Core Processor :
- Zynq UltraScale+ XCZU3EG-1SFVC784E
- Flash Size :
- 128MB
- Moisture Sensitivity Level (MSL) :
- Not Applicable
- Size / Dimension :
- 2.05 x 2.99 52mmx76mm
- Datasheets
- TE0803-02-03EG-1EB
MPU Core Zynq UltraScale+ XCZU3EG-1SFVC784E 2.05 x 2.99 52mmx76mm 0°C~85°C 128MB B2B TE0803 4GB
TE0803-02-03EG-1EB Overview
MPU Core is the module or board type of the microcontroller.With Zynq UltraScale+ XCZU3EG-1SFVC784E cores, microprocessor chip is powered by a processor.The default setting of the microcontroller is 0°C~85°C.MCU electronics 128MB has a flash size of 128MB.Connector type B2B refers to the type of connector.A member of the TE0803 Series, MCU chip has an LCD screen.Software runs normally with RAM size 4GB when the RAM size is reduced.
TE0803-02-03EG-1EB Features
Core processor of Zynq UltraScale+ XCZU3EG-1SFVC784E
Flash size of 128MB
TE0803-02-03EG-1EB Applications
There are a lot of Trenz Electronic GmbH
TE0803-02-03EG-1EB Microcontroller, Microprocessor, FPGA Modules applications.
- Embedded Control Processing
- Embedded User Interfaces
- Test and Measurement
- Medical Devices
- Data Acquisition
- Industrial Control
- Process Control
- Process Monitoring
- Healthcare Monitoring
- Patient Monitoring
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