TDA18264HB/C1
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- Mfr.Part #
- TDA18264HB/C1
- Manufacturer
- NXP Semiconductors
- Package / Case
- 80-TFQFN Exposed Pad
- Datasheet
- Download
- Description
- INTEGRATED CIRCUIT
- Stock
- 1,945
- In Stock ：
- 1,945
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- Manufacturer :
- NXP Semiconductors
- Product Category :
- Telecom
- RoHS Status :
- ROHS3 Compliant
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Mounting Type :
- Surface Mount
- Packaging :
- Tape and Reel (TR)
- Package / Case :
- 80-TFQFN Exposed Pad
- Function :
- Transceiver
- Factory Lead Time :
- 13 Weeks
- Number of Circuits :
- 16
- Power (Watts) :
- 2.55W
- Published :
- 2016
- Datasheets
- TDA18264HB/C1
Telecom device 16 Circuits
TDA18264HB/C1Y Overview
A 80-TFQFN Exposed Pad package saves space on a board.For packing, Tape & Reel (TR) is used.The mounting type is Surface Mount.Telecommunications equipment consists of 16 circuits.
TDA18264HB/C1Y Features
Available in the 80-TFQFN Exposed Pad package
TDA18264HB/C1Y Applications
There are a lot of NXP USA Inc.
TDA18264HB/C1Y Telecom applications.
- LAN Routers
- Digital Modems
- SONET/SDH terminal
- Add/Drop multiplexers (ADMs)
- T1/E1/J1 add/drop multiplexers (MUX)
- Channel Service Units (CSUs): T1/E1/J1
- Fractional T1/E1/J1
- BITS Timing
- Digital Access Cross-connect System (DACs)
- Digital Cross-connect Systems (DCS)
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