TDA18264HB/C1,557
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- Mfr.Part #
- TDA18264HB/C1,557
- Manufacturer
- NXP Semiconductors
- Package / Case
- 80-TFQFN Exposed Pad
- Datasheet
- Download
- Description
- IC TELECOM INTERFACE
- Stock
- 29,501
- In Stock ：
- 29,501
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- Manufacturer :
- NXP Semiconductors
- Product Category :
- Telecom
- Mounting Type :
- Surface Mount
- RoHS Status :
- ROHS3 Compliant
- Function :
- Transceiver
- Published :
- 2016
- Factory Lead Time :
- 13 Weeks
- Package / Case :
- 80-TFQFN Exposed Pad
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Number of Circuits :
- 16
- Packaging :
- Tray
- Power (Watts) :
- 2.55W
- Datasheets
- TDA18264HB/C1,557
Telecom device 16 Circuits
TDA18264HB/C1,557 Overview
Space is saved on the board by using the 80-TFQFN Exposed Pad package.Telecommunications equipment is packed according to Tray's method.In this case, Surface Mount is the mounting type.A 16 circuit is the heart of this telecom IC .
TDA18264HB/C1,557 Features
Available in the 80-TFQFN Exposed Pad package
TDA18264HB/C1,557 Applications
There are a lot of NXP USA Inc.
TDA18264HB/C1,557 Telecom applications.
- Channel Service Units (CSUs): T1/E1/J1
- Fractional T1/E1/J1
- BITS Timing
- Digital Access Cross-connect System (DACs)
- Digital Cross-connect Systems (DCS)
- Frame Relay Switches and Access Devices (FRADS)
- ISDN Primary Rate Interfaces (PRA)
- PBXs channel bank
- PCM channel bank
- T3 channelized access concentrators
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