TC275T64F200NDCKXUMA1

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Mfr.Part #
TC275T64F200NDCKXUMA1
Manufacturer
Infineon Technologies
Package / Case
176-LQFP Exposed Pad
Datasheet
Download
Description
IC MCU 32BIT 4MB FLASH 176LQFP
Stock
1,500
In Stock :
1,500

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Manufacturer :
Infineon Technologies
Product Category :
Microcontrollers
Terminal Form :
Gull wing
Length :
24mm
Peripherals :
DMA, WDT
Additional Feature :
RAM SIZE CAPTURED INCLUSIVE OF CACHE, 48 A/D INPUT LINES; 14 NUMBER OF ADC MODULES
Number of Terminations :
176
Number of I/O :
112
Series :
AURIX™
Voltage - Supply (Vcc/Vdd) :
3V~5.5V
Core Size :
32-Bit Tri-Core
Data Converter :
A/D 40x12b, 6 x Sigma-Delta
Oscillator Type :
External
Height Seated (Max) :
1.6mm
DAC Channels :
No
Width :
24mm
On Chip Program ROM Width :
8
DMA Channels :
yes
Mounting Type :
Surface Mount
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Has ADC :
yes
RAM Size :
472K x 8
Core Processor :
TriCore™
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
Operating Temperature :
-40°C~125°C TA
Terminal Position :
QUAD
Package / Case :
176-LQFP Exposed Pad
Program Memory Type :
Flash
EEPROM Size :
64K x 8
Speed :
200MHz
PWM Channels :
No
ROM (words) :
4194304
Surface Mount :
yes
RAM (bytes) :
483328
uPs/uCs/Peripheral ICs Type :
MICROCONTROLLER
Bit Size :
32
RoHS Status :
ROHS3 Compliant
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
JESD-30 Code :
S-PQFP-G176
Terminal Pitch :
0.5mm
Packaging :
Tape and Reel (TR)
Program Memory Size :
4MB 4M x 8
Introducing Microcontrollers Infineon Technologies TC275T64F200NDCKXUMA1 from Chip IC,where excellence meets affordability. This product stands out with its Number of Terminations:176, Mounting Type:Surface Mount, Operating Temperature:-40°C~125°C TA, Package / Case:176-LQFP Exposed Pad, TC275T64F200NDCKXUMA1 pinout, TC275T64F200NDCKXUMA1 datasheet PDF, TC275T64F200NDCKXUMA1 amp .Beyond Microcontrollers Infineon Technologies TC275T64F200NDCKXUMA1 ,we also offer PIC16F506-I/SL, ATTINY44A-SSN, MS51FB9AE, Our vast inventory has you covered. Contact us now for immediate solutions.

Infineon Technologies TC275T64F200NDCKXUMA1


Microcontrollers Infineon Technologies TC275T64F200NDCKXUMA1 Overview

The Microcontrollers Infineon Technologies TC275T64F200NDCKXUMA1 is a high-performance 32-bit microcontroller unit (MCU) designed to meet the rigorous demands of modern embedded systems. Equipped with a robust 4MB flash memory, this MCU ensures ample space for complex application code and data storage, making it ideal for applications requiring intensive processing and high-speed operations. The TC275T64F200NDCKXUMA1, housed in a 176LQFP package, offers a perfect blend of power, efficiency, and reliability, tailored for sophisticated control systems that demand precise timing and robust functionality.

TC275T64F200NDCKXUMA1 Features

This MCU features a 32-bit architecture that provides a solid foundation for executing complex algorithms and supporting real-time operating systems. Its 4MB of flash memory facilitates advanced applications without compromising performance. The integration in a 176LQFP package allows for high-density mounting and ensures the unit's compatibility with compact designs, further enhancing its application in space-constrained environments.

TC275T64F200NDCKXUMA1 Applications

  • Automotive Control Systems: Utilized in engine management systems and advanced driver-assistance systems (ADAS) to process real-time sensor data and execute control algorithms efficiently.
  • Industrial Automation: Acts as the brain for PLCs and other control units, managing automation tasks in manufacturing lines with high reliability and speed.
  • Medical Devices: Supports functions in critical medical equipment such as diagnostic systems and portable medical monitoring devices, ensuring precise control and reliable operation.
  • Renewable Energy Systems: Used in solar inverters and wind turbine controllers, optimizing energy conversion processes and improving grid management capabilities.
  • Consumer Electronics: Powers sophisticated home automation systems and smart appliances, bringing advanced user interfaces and connectivity features to consumer devices.
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