SST39VF200A-70-4C-B3KE

Manufacturer :

Microchip Technology

Product Category :

Memory

Base Product Number :

SST39VF200

Product Status :

Active

Product Category :

NOR Flash

Operating Supply Voltage :

3.3V

Terminal Finish :

Tin/Silver/Copper (Sn/Ag/Cu)

Brand :

Microchip Technology

Supplier Device Package :

48-TFBGA

Voltage - Supply :

2.7V~3.6V

Organization :

128KX16

Mounting Style :

SMD/SMT

Data Polling :

yes

Sync/Async :

ASYNCHRONOUS

Width :

6 mm

Terminal Position :

BOTTOM

Supply Voltage-Max (Vsup) :

3.6V

Nominal Supply Current :

30mA

Memory Density :

2

Supply Voltage-Min (Vsup) :

2.7V

Number of Sectors/Size :

64

Packaging :

Tray

Pbfree Code :

yes

Number of Pins :

48

Operating Temperature :

0°C~70°C TA

Type :

No Boot Block

Memory Format :

Flash

Manufacturer :

Microchip

Memory Interface :

Parallel

Factory Lead Time :

7 Weeks

Sector Size :

2k

Peak Reflow Temperature (Cel) :

260

Write Cycle Time - Word, Page :

20μs

Speed :

70 ns

Architecture :

Sectored

Number of Terminations :

48

Time@Peak Reflow Temperature-Max (s) :

40

Surface Mount :

yes

Toggle Bit :

yes

Maximum Operating Temperature :

+ 70 C

Common Flash Interface :

yes

Pin Count :

48

Interfaces :

Parallel

Address Bus Width :

17b

Command User Interface :

yes

Height :

0.75 mm

Programming Voltage :

2.7V

Number of Functions :

1

Memory Type :

Non-Volatile

Standard :

Common Flash Interface (CFI)

Base Part Number :

SST39VF200A

Subcategory :

Memory and Data Storage

Terminal Pitch :

0.8mm

Standby Current-Max :

0.00002A

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Product Type :

NOR Flash

Word Size :

16b

Memory Width :

16

Mounting Type :

Surface Mount

Series :

SST39 MPF™

RoHS Status :

ROHS3 Compliant

Length :

8mm

RoHS :

Details

JESD-609 Code :

e1

Supply Voltage :

3V

Package :

Tray

Minimum Operating Temperature :

0 C

Timing Type :

ASYNCHRONOUS

Height Seated (Max) :

1.2mm

HTS Code :

8542.32.00.51

Density :

2 Mb

ECCN Code :

3A991.B.1.A

Memory Organization :

128K x 16

Data Bus Width :

16b

Package / Case :

48-TFBGA

Memory Size :

2Mb 128K x 16

Published :

2000

Access Time :

70ns

Radiation Hardening :

No

Lead Free :

Lead Free

Interface Type :

Parallel