SST39LF801C-55-4C-EKE

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Mfr.Part #
SST39LF801C-55-4C-EKE
Manufacturer
Microchip Technology
Package / Case
48-TFSOP (0.724, 18.40mm Width)
Datasheet
Download
Description
IC FLASH 8MBIT PARALLEL 48TSOP
Stock
384
In Stock :
384

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Manufacturer :
Microchip Technology
Product Category :
Memory
Ready/Busy :
yes
Number of Pins :
48
RoHS Status :
ROHS3 Compliant
Memory Organization :
512K x 16
Toggle Bit :
yes
Memory Size :
8Mb 512K x 16
Series :
SST39 MPF™
Packaging :
Tray
Density :
8 Mb
Interface Type :
Parallel
Data Bus Width :
16b
Radiation Hardening :
No
Timing Type :
ASYNCHRONOUS
Sector Size :
2k
Voltage - Supply :
3V~3.6V
Factory Lead Time :
7 Weeks
Base Part Number :
SST39LF801
Additional Feature :
BOTTOM BOOT BLOCK
Package / Case :
48-TFSOP (0.724, 18.40mm Width)
Memory Type :
Non-Volatile
Operating Temperature :
0°C~70°C TA
Command User Interface :
yes
Standby Current-Max :
0.00002A
Memory Interface :
Parallel
Pin Count :
48
Package :
Tray
Mounting Type :
Surface Mount
Boot Block :
BOTTOM
Write Cycle Time - Word, Page :
10μs
Height Seated (Max) :
1.2mm
JESD-609 Code :
e3
Sync/Async :
ASYNCHRONOUS
Base Product Number :
SST39LF801
Organization :
512KX16
Minimum Operating Temperature :
0 C
Memory Format :
Flash
Peak Reflow Temperature (Cel) :
260
Word Size :
16b
Terminal Position :
Dual
Access Time :
55ns
Product Status :
Active
Supplier Device Package :
48-TSOP
Memory Width :
16
Terminal Pitch :
0.5mm
Operating Supply Voltage :
3.3V
Data Polling :
yes
Address Bus Width :
19b
Time@Peak Reflow Temperature-Max (s) :
40
Length :
18.4mm
Maximum Operating Temperature :
+ 70 C
Supply Voltage-Max (Vsup) :
3.6V
Surface Mount :
yes
Supply Voltage :
3.3V
HTS Code :
8542.32.00.51
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Mounting Style :
SMD/SMT
Programming Voltage :
2.7V
Supply Voltage-Min (Vsup) :
3V
Number of Terminations :
48
ECCN Code :
EAR99
Lead Free :
Lead Free
Number of Functions :
1
Number of Sectors/Size :
256
Nominal Supply Current :
18mA
Common Flash Interface :
yes
Memory Density :
8
Published :
2011
Terminal Finish :
Matte Tin (Sn) - annealed
Interfaces :
Parallel
Introducing Memory Microchip Technology SST39LF801C-55-4C-EKE from Chip IC,where excellence meets affordability. This product stands out with its Number of Pins:48, Base Part Number:SST39LF801, Package / Case:48-TFSOP (0.724, 18.40mm Width), Operating Temperature:0°C~70°C TA, Mounting Type:Surface Mount, Number of Terminations:48, SST39LF801C-55-4C-EKE pinout, SST39LF801C-55-4C-EKE datasheet PDF, SST39LF801C-55-4C-EKE amp .Beyond Memory Microchip Technology SST39LF801C-55-4C-EKE ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Microchip Technology SST39LF801C-55-4C-EKE


Memory Microchip Technology SST39LF801C-55-4C-EKE Overview

The Memory Microchip Technology SST39LF801C-55-4C-EKE is an advanced 8Mbit FLASH memory chip that combines high performance and reliability with a versatile parallel interface. This product is designed using Microchip's proven multi-purpose Flash technology, which allows for excellent endurance and stability in a broad range of applications. The compact 48-TSOP package ensures that it can be integrated into a variety of hardware setups, making it an ideal choice for developers looking to maximize storage capabilities without compromising on physical space. This memory component is particularly suited for devices requiring fast and reliable non-volatile memory. Its robust design and efficient power management capabilities make it a preferred option for manufacturers looking to enhance their systems with long-lasting, dependable storage solutions.

SST39LF801C-55-4C-EKE Features

  • High-density 8Mbit storage capacity
  • Parallel interface for fast data transfer rates
  • Low power consumption for enhanced energy efficiency
  • Operational durability across a wide range of temperatures
  • Compact 48-TSOP packaging fits into smaller form factors
  • Manufactured by Microchip Technology, a leader in semiconductor innovation

SST39LF801C-55-4C-EKE Applications

  • Embedded Systems: Utilized in controlling operations, such as in robotics and automotive systems, where its reliability and speed enhance performance.
  • Consumer Electronics: Forms the backbone of memory storage in devices such as digital cameras and gaming consoles, where large amounts of data need to be accessed quickly and reliably.
  • Telecommunication Equipment: Supports data logging and firmware updates in devices such as modems and routers, providing stable and reliable operations.
  • Industrial Automation: Plays a critical role in process control equipment, where its durability and endurance are essential for consistent, long-term operation.
  • Medical Devices: Used in various diagnostic and therapeutic medical instruments that require high-reliability data storage solutions.
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