SN74LVC2G17DCKR
- Mfr.Part #
- SN74LVC2G17DCKR
- Manufacturer
- Texas Instruments
- Package / Case
- 6-TSSOP, SC-88, SOT-363
- Datasheet
- Download
- Description
- IC BUF NON-INVERT 5.5V SC70-6
- Stock
- 4,509
- In Stock :
- 4,509
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- Manufacturer :
- Texas Instruments
- Product Category :
- Buffers, Drivers, Receivers, Transceivers
- Power Supplies :
- 3.3V
- Input Type :
- Schmitt Trigger
- Thickness :
- 900μm
- Supply Voltage :
- 3.3V
- Pin Count :
- 6
- Operating Temperature :
- -40°C~125°C TA
- Current - Output High, Low :
- 32mA 32mA
- Prop. Delay@Nom-Sup :
- 5.4 ns
- Termination :
- SMD/SMT
- Base Part Number :
- 74LVC2G17
- Logic Type :
- Buffer, Non-Inverting
- Series :
- 74LVC
- Lead Free :
- Lead Free
- Contact Plating :
- Gold
- Polarity :
- Non-Inverting
- Number of Terminations :
- 6
- Propagation Delay :
- 4.3 ns
- Number of Channels :
- 2
- Number of Pins :
- 6
- Lifecycle Status :
- ACTIVE (Last Updated: 5 days ago)
- Length :
- 2mm
- JESD-609 Code :
- e4
- Packaging :
- Cut Tape (CT)
- Mounting Type :
- Surface Mount
- RoHS Status :
- ROHS3 Compliant
- Peak Reflow Temperature (Cel) :
- 260
- Mount :
- Surface Mount
- Pbfree Code :
- yes
- Package / Case :
- 6-TSSOP, SC-88, SOT-363
- Factory Lead Time :
- 6 Weeks
- Logic Function :
- Buffer, Schmitt Trigger
- Supply Voltage-Max (Vsup) :
- 5.5V
- Radiation Hardening :
- No
- Output Type :
- Push-Pull
- Number of Functions :
- 2
- Packing Method :
- TR
- Number of Inputs :
- 2
- Width :
- 1.25mm
- Family :
- LVC/LCX/Z
- Number of Bits per Element :
- 1
- Load Capacitance :
- 50pF
- Max Junction Temperature (Tj) :
- 150°C
- Terminal Form :
- Gull wing
- ECCN Code :
- EAR99
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- Voltage - Supply :
- 1.65V~5.5V
- REACH SVHC :
- No SVHC
- Height :
- 1.1mm
- Terminal Position :
- Dual
- Turn On Delay Time :
- 9.3 ns
- Nominal Supply Current :
- 250mA
- Quiescent Current :
- 10μA
- Schmitt Trigger Input :
- yes
- Datasheets
- SN74LVC2G17DCKR

Buffers, Drivers, Receivers, Transceivers Texas Instruments SN74LVC2G17DCKR Overview
The SN74LVC2G17DCKR from Texas Instruments is a high-performance dual Schmitt-trigger buffer designed to ensure signal integrity and improve noise margins in digital and mixed-signal environments. This component is part of the Buffers, Drivers, Receivers, Transceivers category, enhancing its utility in a broad range of applications. The device operates with a supply voltage range from 1.65V to 5.5V, making it suitable for interfacing with both 3.3V and 5V systems. The SN74LVC2G17DCKR features a compact SC706 package, optimized for space-sensitive applications while providing robust support for high-speed signal conditioning and voltage translation.
SN74LVC2G17DCKR Features
The SN74LVC2G17DCKR boasts several key features that make it ideal for sophisticated electronic systems. These include:
- Low power consumption, facilitating extended battery life in portable devices.
- High noise immunity characteristic of Schmitt-trigger inputs, ensuring reliable performance in noisy environments.
- Wide operating voltage range, compatible with various logic levels and enabling flexible design options.
- Compact SC706 package, perfect for space-constrained applications.
- Robust ESD protection, enhancing the durability and longevity of the device.
SN74LVC2G17DCKR Applications
- Smartphones and Tablets: Used in I/O expansion modules to enhance signal integrity between high-speed processors and peripheral components.
- Portable Medical Devices: Ensures reliable operation of critical sensor signal processing, where accurate signal conditioning is paramount.
- Wearable Technology: Employs buffering to stabilize input signals from various sensors, maintaining consistent performance amidst fluctuating power and environmental conditions.
- Industrial Automation: Facilitates robust signal conditioning in automated control systems, crucial for managing high-speed digital communications within noisy industrial environments.
- Consumer Electronics: Integrated in home automation systems to buffer and stabilize signals between different electronic modules, ensuring reliable device interoperability.
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