SN74AVC4T245RSVR

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Mfr.Part #
SN74AVC4T245RSVR
Manufacturer
Texas Instruments
Package / Case
16-UFQFN
Datasheet
Download
Description
IC TRANSLATION TXRX 3.6V 16UQFN
Stock
724
In Stock :
724

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Manufacturer :
Texas Instruments
Product Category :
Buffers, Drivers, Receivers, Transceivers
Number of Terminations :
16
Control Type :
COMMON CONTROL
Logic Function :
Transceiver, Translator
Number of Bits :
2
Terminal Finish :
Nickel/Palladium/Gold (Ni/Pd/Au)
Number of Circuits :
2
Package / Case :
16-UFQFN
RoHS Status :
ROHS3 Compliant
Prop. Delay@Nom-Sup :
6.3 ns
Operating Temperature :
-40°C~85°C TA
Factory Lead Time :
8 Weeks
JESD-609 Code :
e4
Width :
1.8mm
Number of Inputs :
4
Length :
2.6mm
Packing Method :
TR
Voltage - VCCA :
1.2V~3.6V
Mount :
Surface Mount
Low Level Output Current :
12mA
Data Rate :
380Mbps
Thickness :
500μm
Mounting Type :
Surface Mount
Output Type :
Tri-State, Non-Inverted
Translator Type :
Voltage Level
REACH SVHC :
No SVHC
Moisture Sensitivity Level (MSL) :
1 (Unlimited)
Pbfree Code :
yes
Number of Pins :
16
Min Supply Voltage :
1.2V
Logic IC Type :
BUS TRANSCEIVER
Terminal Position :
QUAD
Family :
AVC
Peak Reflow Temperature (Cel) :
260
Output Current :
12mA
Voltage - VCCB :
1.2V~3.6V
Translation :
1.5/3.3Vand1.5/3.3V
Turn On Delay Time :
2.9 ns
Series :
74AVC
Number of Ports :
2
Supply Voltage :
1.5V
Lifecycle Status :
ACTIVE (Last Updated: 3 days ago)
Weight :
40.908362mg
Ambient Temperature Range High :
85°C
Radiation Hardening :
No
Pin Count :
16
Additional Feature :
TWO SEPARATE CONFIGURABLE POWER-SUPPLY FOR PORT A AND PORT B
Lead Free :
Lead Free
Power Supplies :
1.5/3.3V
Polarity :
Non-Inverting
Channel Type :
Bidirectional
Output Characteristics :
3-STATE
High Level Output Current :
-12mA
Propagation Delay :
2.9 ns
Quiescent Current :
80μA
Height :
550μm
Max Supply Voltage :
3.6V
ECCN Code :
EAR99
Base Part Number :
74AVC4T245
Load Capacitance :
15pF
Number of Functions :
2
Packaging :
Tape and Reel (TR)
Datasheets
SN74AVC4T245RSVR
Introducing Buffers, Drivers, Receivers, Transceivers Texas Instruments SN74AVC4T245RSVR from Chip IC,where excellence meets affordability. This product stands out with its Number of Terminations:16, Package / Case:16-UFQFN, Operating Temperature:-40°C~85°C TA, Mounting Type:Surface Mount, Number of Pins:16, Base Part Number:74AVC4T245, SN74AVC4T245RSVR pinout, SN74AVC4T245RSVR datasheet PDF, SN74AVC4T245RSVR amp .Beyond Buffers, Drivers, Receivers, Transceivers Texas Instruments SN74AVC4T245RSVR ,we also offer SN74LVC244APWR, SN74AUP1G07DCKR, SN74LVC2G125DCUR, Our vast inventory has you covered. Contact us now for immediate solutions.

Texas Instruments SN74AVC4T245RSVR


Buffers, Drivers, Receivers, Transceivers Texas Instruments SN74AVC4T245RSVR Overview

The Texas Instruments SN74AVC4T245RSVR is an essential component for modern electronics, designed to handle voltage level translation across dual-supply applications efficiently. This Integrated Circuit (IC) from Texas Instruments facilitates seamless communication between devices operating at different voltage levels, ranging from 1.2V to 3.6V. As a versatile bus transceiver, the SN74AVC4T245RSVR is suitable for various digital applications, ensuring reliable performance with its robust design and advanced technology. The device's compact 16-UQFN package makes it ideal for space-constrained applications, highlighting the expert engineering of Texas Instruments in providing solutions that meet stringent industry requirements.

SN74AVC4T245RSVR Features

  • Dual-supply voltage level translation from 1.2V to 3.6V
  • Low on-state resistance
  • High-speed data transfer capabilities
  • 16-UQFN package for reduced footprint
  • I/O auto-direction sensing simplifies design
  • ESD protection

SN74AVC4T245RSVR Applications

  • Multi-Voltage Systems: Facilitates communication between components with different operating voltage levels, essential for battery-operated and power-sensitive devices.
  • Logic Level Translation: Used in digital interfacing applications, ensuring compatibility across different logic families.
  • Mobile Devices: Integral in the design of smartphones and tablets where space and power efficiency are crucial.
  • Computing: Applies in various computing scenarios, from motherboards to peripheral devices, enhancing connectivity and performance.
  • Industrial Applications: Employs robust design suited for harsh environments typical of industrial settings.
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