SN74ALVC7803-40DLR

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Mfr.Part #
SN74ALVC7803-40DLR
Manufacturer
Texas Instruments
Package / Case
56-BSSOP (0.295, 7.50mm Width)
Datasheet
Download
Description
IC MEMORY FIFO 512X18 56-SSOP
Stock
18,552
In Stock :
18,552

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Manufacturer :
Texas Instruments
Product Category :
FIFOs Memory
Voltage - Supply :
3V~3.6V
Cycle Time :
40 ns
Moisture Sensitivity Level (MSL) :
1 (Unlimited)
Power Supplies :
3.3V
Supply Voltage-Min (Vsup) :
3.3V
ECCN Code :
EAR99
HTS Code :
8542.32.00.71
Length :
18.415mm
Memory Density :
9216 bit
Organization :
512X18
Memory Size :
9K 512 x 18
Clock Frequency :
25MHz
Bus Directional :
Uni-Directional
Width :
7.5mm
Data Rate :
25MHz
Supply Voltage-Max (Vsup) :
3.6V
Access Time :
20ns
Terminal Pitch :
0.635mm
Package / Case :
56-BSSOP (0.295, 7.50mm Width)
Current - Supply (Max) :
40μA
Number of Pins :
56
Expansion Type :
Width
Base Part Number :
74ALVC7803
Packaging :
Tape and Reel (TR)
Memory IC Type :
OTHER FIFO
Supply Voltage :
3.3V
Height Seated (Max) :
2.79mm
Output Characteristics :
3-STATE
Operating Temperature :
0°C~70°C
Mounting Type :
Surface Mount
RoHS Status :
ROHS3 Compliant
Parallel/Serial :
Parallel
Series :
74ALVC
Terminal Form :
Gull wing
Terminal Position :
Dual
Retransmit Capability :
No
Memory Width :
18
Programmable Flags Support :
yes
Function :
SYNCHRONOUS
Output Enable :
yes
Mount :
Surface Mount
Number of Terminations :
56
Introducing FIFOs Memory Texas Instruments SN74ALVC7803-40DLR from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:56-BSSOP (0.295, 7.50mm Width), Number of Pins:56, Base Part Number:74ALVC7803, Operating Temperature:0°C~70°C, Mounting Type:Surface Mount, Number of Terminations:56, SN74ALVC7803-40DLR pinout, SN74ALVC7803-40DLR datasheet PDF, SN74ALVC7803-40DLR amp .Beyond FIFOs Memory Texas Instruments SN74ALVC7803-40DLR ,we also offer CY7C433-40JC, SN74ACT7201LA35RJ, SN74ACT7201LA35NP, Our vast inventory has you covered. Contact us now for immediate solutions.

Texas Instruments SN74ALVC7803-40DLR


FIFOs Memory Texas Instruments SN74ALVC7803-40DLR Overview

The FIFOs Memory Texas Instruments SN74ALVC7803-40DLR is a high-performance Integrated Circuit specifically designed to meet the demanding requirements of data buffering applications. This memory component, featuring a 512 x 18 bit configuration, is housed in a compact 56SSOP package, making it ideal for systems where space is at a premium. The SN74ALVC7803-40DLR is crafted to facilitate smooth and reliable data flow between mismatched speed processors or varying bus loads, ensuring minimal data delay and high throughput in critical applications. Its robust design and advanced technology render it perfect for a wide range of commercial and industrial applications, particularly where rapid data access and buffer reliability are essential.

SN74ALVC7803-40DLR Features

The SN74ALVC7803-40DLR offers several distinctive features that enhance its utility in sophisticated electronic systems:

  • 512 x 18 memory array enables substantial data storage and quick access.
  • Low operational voltage and power dissipation ensure energy efficiency.
  • Fast read and write cycle times facilitate high-speed data processing.
  • Compatible with a wide range of operating temperatures, making it suitable for use in diverse environmental conditions.

SN74ALVC7803-40DLR Applications

  • Data Streaming Devices: Utilized in multimedia streaming devices to manage data integrity and ensure seamless audio and video playback.
  • Communications Equipment: Employed in communication infrastructures to buffer data packets, optimizing the flow and reducing latency in networks.
  • Server and Storage Systems: Acts as a critical component in servers and high-performance storage systems, aiding in data sorting and temporary storage during peak loads.
  • Industrial Control Systems: Integrated into industrial controls to handle rapid data exchanges, improving system responsiveness and reliability.
  • Medical Imaging Equipment: Used in medical imaging technologies to enhance data transfer rates between different system components, crucial for real-time imaging processes.
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