SN74ABT16646DLR

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Mfr.Part #
SN74ABT16646DLR
Manufacturer
Texas Instruments
Package / Case
56-BSSOP (0.295, 7.50mm Width)
Datasheet
Download
Description
IC TXRX NON-INVERT 5.5V 56SSOP
Stock
5,640
In Stock :
5,640

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Manufacturer :
Texas Instruments
Product Category :
Buffers, Drivers, Receivers, Transceivers
Max I(ol) :
0.064 A
Factory Lead Time :
6 Weeks
Supply Voltage :
5V
Current - Output High, Low :
32mA 64mA
Radiation Hardening :
No
Operating Temperature :
-40°C~85°C TA
Load Capacitance :
50pF
Number of Elements :
2
Terminal Pitch :
0.635mm
Number of Pins :
56
Voltage - Supply :
4.5V~5.5V
Height :
2.79mm
Prop. Delay@Nom-Sup :
4.6 ns
Schmitt Trigger :
No
Package / Case :
56-BSSOP (0.295, 7.50mm Width)
Terminal Form :
Gull wing
Direction :
Bidirectional
Number of Ports :
2
ECCN Code :
EAR99
Additional Feature :
WITH DIRECTION CONTROL; SELECT INPUT FOR MULTIPLEXED TRANSMISSION OF REGISTERED OR REAL TIME DATA
Mounting Type :
Surface Mount
Number of Bits per Element :
8
Propagation Delay :
6.7 ns
Logic Function :
Inverting, Transceiver
Width :
7.49mm
Pin Count :
56
Packaging :
Cut Tape (CT)
Lead Free :
Lead Free
Trigger Type :
POSITIVE EDGE
JESD-609 Code :
e4
Control Type :
INDEPENDENT CONTROL
Logic Type :
Transceiver, Non-Inverting
Number of Terminations :
56
Power Supplies :
5V
RoHS Status :
ROHS3 Compliant
Turn On Delay Time :
6.7 ns
Thickness :
2.59mm
Weight :
694.790113mg
Peak Reflow Temperature (Cel) :
260
Terminal Position :
Dual
Series :
74ABT
Length :
18.41mm
Terminal Finish :
Nickel/Palladium/Gold (Ni/Pd/Au)
Pbfree Code :
yes
Operating Supply Voltage :
5V
Polarity :
Non-Inverting
Number of Outputs :
16
Lifecycle Status :
ACTIVE (Last Updated: 1 week ago)
Number of Functions :
2
Moisture Sensitivity Level (MSL) :
1 (Unlimited)
Output Type :
3-STATE
Mount :
Surface Mount
Translation :
n/a
Family :
ABT
Base Part Number :
74ABT16646
Packing Method :
TR
Power Supply Current-Max (ICC) :
0.035mA
Datasheets
SN74ABT16646DLR
Introducing Buffers, Drivers, Receivers, Transceivers Texas Instruments SN74ABT16646DLR from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:-40°C~85°C TA, Number of Pins:56, Package / Case:56-BSSOP (0.295, 7.50mm Width), Mounting Type:Surface Mount, Number of Terminations:56, Base Part Number:74ABT16646, SN74ABT16646DLR pinout, SN74ABT16646DLR datasheet PDF, SN74ABT16646DLR amp .Beyond Buffers, Drivers, Receivers, Transceivers Texas Instruments SN74ABT16646DLR ,we also offer SN74LVC244APWR, SN74AUP1G07DCKR, SN74LVC2G125DCUR, Our vast inventory has you covered. Contact us now for immediate solutions.

Texas Instruments SN74ABT16646DLR


Buffers, Drivers, Receivers, Transceivers Texas Instruments SN74ABT16646DLR Overview

Introducing the cutting-edge solution from Texas Instruments, the SN74ABT16646DLR Integrated Circuit (IC) - a pinnacle of innovation in the realm of Buffers, Drivers, Receivers, and Transceivers. Designed to exceed industry standards, this IC stands as a testament to Texas Instruments' commitment to excellence and reliability.

With its unparalleled performance and versatility, the SN74ABT16646DLR caters to the most demanding industrial requirements, ensuring seamless data transmission and reception across a wide range of applications.

Experience the future of electronic components with Texas Instruments' SN74ABT16646DLR - where precision meets reliability, setting a new benchmark in the realm of integrated circuits.

SN74ABT16646DLR Features

  • Advanced Non-Inverting Buffers, Drivers, Receivers, and Transceivers
  • Operating Voltage Range: 4.2V to 5.5V
  • High-Speed, Low-Power CMOS Technology
  • Wide Operating Temperature Range: -40°C to 85°C
  • 56-Pin SSOP Package for Compact Integration
  • Robust ESD Performance
  • Industry-Leading Quality and Reliability

SN74ABT16646DLR Applications

  • Data Communication Systems: Implementing efficient data transmission in networking equipment, ensuring seamless communication in high-demand environments.
  • Industrial Automation: Enabling precise control and monitoring in automated systems, enhancing productivity and reliability in manufacturing processes.
  • Telecommunication Infrastructure: Facilitating reliable signal transmission in telecommunication networks, ensuring uninterrupted connectivity and communication.
  • Automotive Electronics: Enhancing the performance of automotive electronic systems, enabling robust data exchange in vehicles for enhanced safety and functionality.
  • Embedded Systems: Integrating seamlessly into embedded systems for data processing and communication, ensuring efficient operation in diverse electronic applications.
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