SM32VC5510AGGWA2EP
- Mfr.Part #
- SM32VC5510AGGWA2EP
- Manufacturer
- Texas Instruments
- Package / Case
- 240-LFBGA
- Datasheet
- Download
- Description
- IC DSP FIXED-POINT 240-BGA
- Stock
- 39,744
- In Stock :
- 39,744
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- Manufacturer :
- Texas Instruments
- Product Category :
- DSP (Digital Signal Processors)
- Terminal Pitch :
- 0.8mm
- Lifecycle Status :
- NRND (Last Updated: 2 days ago)
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Type :
- FIXED POINT
- Width :
- 15mm
- Length :
- 15mm
- Number of DMA Channels :
- 6
- Operating Temperature :
- -40°C~85°C TC
- Lead Free :
- Contains Lead
- Number of Timers :
- 2
- Voltage - I/O :
- 3.30V
- Terminal Finish :
- Tin/Lead (Sn/Pb)
- Radiation Hardening :
- No
- Number of Pins :
- 240
- On Chip Data RAM :
- 344kB
- HTS Code :
- 8542.31.00.01
- Series :
- TMS320C55x
- Number of Terminations :
- 240
- Frequency :
- 200MHz
- Thickness :
- 900μm
- Data Bus Width :
- 16b
- Height :
- 1.4mm
- RoHS Status :
- Non-RoHS Compliant
- Low Power Mode :
- yes
- Boundary Scan :
- yes
- ECCN Code :
- 3A991.A.2
- Peak Reflow Temperature (Cel) :
- 220
- Base Part Number :
- 32VC5510
- Supply Voltage :
- 1.6V
- Terminal Position :
- BOTTOM
- Non-Volatile Memory :
- ROM (32kB)
- Number of Bits :
- 16
- Memory Size :
- 32kB
- Internal Bus Architecture :
- Multiple
- Mount :
- Surface Mount
- Bit Size :
- 16
- Package / Case :
- 240-LFBGA
- Barrel Shifter :
- No
- Pin Count :
- 240
- Operating Supply Voltage :
- 3.3V
- JESD-609 Code :
- e0
- RAM Size :
- 320kB
- Min Supply Voltage :
- 1.55V
- Mounting Type :
- Surface Mount
- ROM Programmability :
- MROM
- Interface :
- Host Interface, McBSP
- Weight :
- 529.08715mg
- Packaging :
- Tray
- Terminal Form :
- Ball
- Voltage - Core :
- 1.60V
- Additional Feature :
- ALSO REQUIRES 3.3V SUPPLY
- Number of External Interrupts :
- 7
- Integrated Cache :
- yes
- Max Supply Voltage :
- 3.6V
- Datasheets
- SM32VC5510AGGWA2EP

DSP Texas Instruments SM32VC5510AGGWA2EP Overview
The DSP Texas Instruments SM32VC5510AGGWA2EP is a high-performance, fixed-point digital signal processor designed to meet the rigorous demands of complex digital processing tasks in embedded applications. This IC offers a robust architecture optimized for low power consumption and high-speed operation, making it an ideal choice for developers aiming to enhance audio, video, and signal processing capabilities in their products. With its BGA packaging, the SM32VC5510AGGWA2EP ensures efficient space utilization on PCBs, providing a compact yet powerful solution for a variety of demanding applications.
SM32VC5510AGGWA2EP Features
- High-performance fixed-point processing capability
- Compact 240-BGA package for space-sensitive applications
- Optimized for low power consumption, enhancing battery life in portable devices
- Advanced peripherals for enhanced interfacing and functionality
- Supports a wide range of signal processing applications
SM32VC5510AGGWA2EP Applications
- Audio Processing Devices: Utilized in developing high-fidelity audio systems where precise signal manipulation is crucial.
- Telecommunications: Employs advanced algorithms for signal modulation and demodulation, improving communication reliability and quality.
- Medical Imaging Systems: Facilitates complex algorithms for real-time imaging, crucial in diagnostic equipment such as ultrasound and MRI machines.
- Automotive Electronics: Enhances functionalities in vehicle systems, including audio processing and sensor data analysis.
- Industrial Automation: Drives the processing of sensor data and control signals, leading to more efficient and automated industrial systems.
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