SC18IS606PWJ

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Mfr.Part #
SC18IS606PWJ
Manufacturer
NXP Semiconductors
Package / Case
16-TSSOP (0.173, 4.40mm Width)
Datasheet
Download
Description
IC I2C TO SPI BRIDGE
Stock
2,576
In Stock :
2,576

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Manufacturer :
NXP Semiconductors
Product Category :
Controllers
Standards :
-
Manufacturer :
NXP
RoHS :
Details
Protocol :
I²C
Package :
Tape and Reel (TR);Cut Tape (CT);Digi-Reel®;
Product Category :
Interface - Specialized
MSL :
MSL 1 - Unlimited
Interface :
SPI
Operating Temperature :
-40°C ~ 105°C (TA)
Current - Supply :
4mA
Subcategory :
Interface ICs
Bridge Type :
I2C to SPI
Packaging :
Cut Tape
Function :
Controller
Product Status :
Active
Supplier Device Package :
16-TSSOP
Voltage - Supply :
1.71V ~ 3.6V
Product Type :
Interface - Specialized
Package / Case :
16-TSSOP (0.173, 4.40mm Width)
Brand :
NXP Semiconductors
Series :
-
Datasheets
SC18IS606PWJ
Introducing Controllers NXP Semiconductors SC18IS606PWJ from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:-40°C ~ 105°C (TA), Package / Case:16-TSSOP (0.173, 4.40mm Width), SC18IS606PWJ pinout, SC18IS606PWJ datasheet PDF, SC18IS606PWJ amp .Beyond Controllers NXP Semiconductors SC18IS606PWJ ,we also offer DS28E17Q+T, VNC2-32Q1C-REEL, FT311D-32Q1C-R, Our vast inventory has you covered. Contact us now for immediate solutions.

NXP Semiconductors SC18IS606PWJ


Controllers NXP Semiconductors SC18IS606PWJ Overview

The Controllers NXP Semiconductors SC18IS606PWJ IC is a highly specialized and advanced interface chip designed specifically to bridge I2C protocols to SPI communications. This product is an essential component in modern electronics where devices require communication across different protocol standards. Ideal for applications needing low-power consumption and high-speed data transfer, the SC18IS606PWJ facilitates smooth and reliable interfacing, making it an invaluable part of any system integration that aims to enhance interoperability and performance.

SC18IS606PWJ Features

The SC18IS606PWJ from NXP Semiconductors boasts a range of features designed to optimize and simplify the integration of SPI and I2C communication interfaces. It supports multi-master and slave configurations, offering flexibility in system design. Additionally, it includes an internal oscillator which reduces the number of external components required, enhancing system reliability and reducing overall cost. The chip's low power consumption makes it suitable for mobile and embedded applications, while its small package size allows for use in space-constrained applications.

SC18IS606PWJ Applications

  • Consumer Electronics: Used in devices like smart home systems and multimedia devices to enable efficient communication between controllers and peripherals that operate on different communication protocols.
  • Automotive Applications: Facilitates communication between microcontrollers and sensors, critical in applications such as advanced driver-assistance systems (ADAS) where reliable data transmission is crucial.
  • Industrial Automation: Enhances machine-to-machine communication by allowing devices with incompatible bus interfaces to connect and communicate effectively, thus optimizing operational efficiencies.
  • Mobile Devices: Integrated into smartphones and tablets to allow seamless communication between core processors and peripheral devices, improving device functionality and user experience.
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