SC18IS602BIPW/S8HP

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Mfr.Part #
SC18IS602BIPW/S8HP
Manufacturer
NXP Semiconductors
Package / Case
16-TSSOP (0.173, 4.40mm Width)
Datasheet
Download
Description
IC BRIDGE SPI/I2C 16TSSOP
Stock
10,670
In Stock :
10,670

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Manufacturer :
NXP Semiconductors
Product Category :
Controllers
JESD-609 Code :
e4
Peak Reflow Temperature (Cel) :
260
Number of Terminations :
16
Terminal Pitch :
0.65mm
Supply Voltage :
3V
Time@Peak Reflow Temperature-Max (s) :
30
Bus Compatibility :
I2C
HTS Code :
8542.31.00.01
RoHS Status :
ROHS3 Compliant
JESD-30 Code :
R-PDSO-G16
Operating Temperature :
-40°C~85°C
Terminal Finish :
Nickel/Palladium/Gold (Ni/Pd/Au)
Published :
2005
Terminal Position :
Dual
Data Transfer Rate-Max :
0.225 MBps
Surface Mount :
yes
Factory Lead Time :
14 Weeks
Protocol :
I2C
Terminal Form :
Gull wing
Height Seated (Max) :
1.1mm
Moisture Sensitivity Level (MSL) :
1 (Unlimited)
Voltage - Supply :
2.4V~3.6V
Current - Supply :
11mA
Width :
4.4mm
Interface :
SPI
Length :
5mm
Package / Case :
16-TSSOP (0.173, 4.40mm Width)
Packaging :
Tape and Reel (TR)
Function :
Controller
Introducing Controllers NXP Semiconductors SC18IS602BIPW/S8HP from Chip IC,where excellence meets affordability. This product stands out with its Number of Terminations:16, Operating Temperature:-40°C~85°C, Package / Case:16-TSSOP (0.173, 4.40mm Width), SC18IS602BIPW/S8HP pinout, SC18IS602BIPW/S8HP datasheet PDF, SC18IS602BIPW/S8HP amp .Beyond Controllers NXP Semiconductors SC18IS602BIPW/S8HP ,we also offer DS28E17Q+T, VNC2-32Q1C-REEL, FT311D-32Q1C-R, Our vast inventory has you covered. Contact us now for immediate solutions.

NXP Semiconductors SC18IS602BIPW/S8HP


Controllers NXP Semiconductors SC18IS602BIPW/S8HP Overview

The Controllers NXP Semiconductors SC18IS602BIPW/S8HP is an innovative interface bridge designed for the efficient management of peripheral communications via SPI to I2C. As a vital component in embedded systems, this IC simplifies the integration of devices that primarily support I2C protocol communication into systems predominantly using SPI bus. With its compact 16-TSSOP packaging, it seamlessly fits into various applications, particularly where space and power management are critical. Its robust design and versatility make it a perfect choice for developers looking to enhance system performance while ensuring reliable data transmission.

SC18IS602BIPW/S8HP Features

This IC bridge by NXP Semiconductors offers several features that make it ideal for bridging SPI and I2C interfaces. Key features include:

  • Simple protocol conversion from SPI master to I2C slave interface.
  • High-speed operation with I2C frequencies up to 400 kHz and SPI frequencies up to 1.8 MHz.
  • Low power consumption which is crucial for portable device applications.
  • Integrated oscillator reducing external component requirements.
  • Supports up to four I2C slave devices, enhancing its applicability in complex systems.
  • Small footprint 16-TSSOP package suitable for space-constrained applications.

SC18IS602BIPW/S8HP Applications

  • Smart Home Devices: Enables communication between core SPI-based processors and I2C sensors, improving integration and functionality in smart home ecosystems.
  • Industrial Automation: Facilitates robust data exchange between SPI-based controllers and I2C-equipped sensors and actuators, enhancing system reliability and performance in industrial settings.
  • Consumer Electronics: Used in products like smartphones and tablets to expand functionality through additional sensors or peripherals without native SPI support.
  • Automotive Systems: Employs bridge capabilities to connect SPI-based automotive controllers to I2C-based sensors, improving vehicle monitoring and control systems.
  • Wearable Technology: Integrates I2C sensors with SPI-based processing units in compact devices, optimizing power and space usage in wearables.
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Shipping Cost

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