SC16C852SVIET,157

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Mfr.Part #
SC16C852SVIET,157
Manufacturer
NXP Semiconductors
Package / Case
36-TFBGA
Datasheet
Download
Description
IC UART DL 1.8V W/FIFO 36-TFBGA
Stock
25,853
In Stock :
25,853

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Manufacturer :
NXP Semiconductors
Product Category :
UARTs (Universal Asynchronous Receiver Transmitter)
Data Encoding/Decoding Method :
NRZ
Supply Voltage :
1.8V
Boundary Scan :
No
Power Supplies :
1.8V
Terminal Position :
BOTTOM
Factory Lead Time :
7 Weeks
With False Start Bit Detection :
yes
Terminal Form :
Ball
Address Bus Width :
8
FIFO's :
128 Byte
Time@Peak Reflow Temperature-Max (s) :
30
JESD-30 Code :
S-PBGA-B36
Length :
3.5mm
Protocol :
RS485
External Data Bus Width :
8
Peak Reflow Temperature (Cel) :
260
Pin Count :
36
Operating Temperature (Min) :
-40°C
Operating Temperature (Max) :
85°C
Clock Frequency :
80MHz
Temperature Grade :
Industrial
Moisture Sensitivity Level (MSL) :
1 (Unlimited)
Width :
3.5mm
HTS Code :
8542.31.00.01
Terminal Finish :
Tin/Silver/Copper (Sn/Ag/Cu)
Mounting Type :
Surface Mount
Number of Serial I/Os :
2
JESD-609 Code :
e1
uPs/uCs/Peripheral ICs Type :
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
Base Part Number :
SC16C852
Packaging :
Tray
Voltage - Supply :
1.8V
Qualification Status :
Not Qualified
Published :
2008
Number of Terminations :
36
Data Transfer Rate-Max :
0.0000012122176018 MBps
Surface Mount :
yes
Package / Case :
36-TFBGA
RoHS Status :
ROHS3 Compliant
Number of Channels :
2, DUART
Low Power Mode :
yes
Terminal Pitch :
0.5mm
Data Rate (Max) :
20Mbps
Height Seated (Max) :
1.15mm
Datasheets
SC16C852SVIET,157
Introducing UARTs (Universal Asynchronous Receiver Transmitter) NXP Semiconductors SC16C852SVIET,157 from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Base Part Number:SC16C852, Number of Terminations:36, Package / Case:36-TFBGA, Number of Channels:2, DUART, SC16C852SVIET,157 pinout, SC16C852SVIET,157 datasheet PDF, SC16C852SVIET,157 amp .Beyond UARTs (Universal Asynchronous Receiver Transmitter) NXP Semiconductors SC16C852SVIET,157 ,we also offer ST16C550CJ44-F, TL16C550DIPFB, TL16C452FNR, Our vast inventory has you covered. Contact us now for immediate solutions.

NXP Semiconductors SC16C852SVIET,157


UARTs NXP Semiconductors SC16C852SVIET,157 Overview

The UARTs NXP Semiconductors SC16C852SVIET,157 is a high-performance integrated circuit designed for advanced communication solutions. This dual universal asynchronous receiver-transmitter (UART) operates at a low voltage of 1.8V and is equipped with FIFO buffers, which enhances its efficiency in data handling. Its small form factor, encapsulated in a 36-pin TFBGA package, makes it an ideal choice for applications requiring minimal space and power consumption without compromising on speed and reliability. The integration of FIFO in the SC16C852SVIET,157 facilitates improved data flow management and reduces the overhead on the CPU, which is crucial for high-speed data communication tasks.

SC16C852SVIET,157 Features

  • Low voltage operation at 1.8V, suitable for battery-powered and portable devices.
  • Dual-channel UART, enabling simultaneous communication streams.
  • Incorporates FIFO buffers, significantly improving data throughput and system reliability.
  • Compact 36TFBGA package, ideal for designs with limited PCB space.
  • High data transfer rate, suitable for high-speed communication requirements.

SC16C852SVIET,157 Applications

  • Consumer Electronics: Used in smart home devices, enhancing communication between devices with efficient power usage.
  • Industrial Automation: Facilitates robust data communication in industrial control systems, ensuring reliability under harsh conditions.
  • Automotive: Integrates into onboard diagnostics systems, allowing for real-time vehicle status and diagnostics over UART communications.
  • Telecommunications: Essential for data handling in telecommunications equipment, supporting high-speed data exchange and reliability.
  • Portable Devices: Ideal for portable medical devices and mobile communication tools, where power efficiency and compact sizing are critical.
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