S70GL02GP11FAIR23
- Mfr.Part #
- S70GL02GP11FAIR23
- Manufacturer
- Infineon Technologies
- Package / Case
- 64-LBGA
- Datasheet
- Download
- Description
- IC FLASH 2GBIT PARALLEL 64FBGA
- Stock
- 45,114
- In Stock :
- 45,114
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- Manufacturer :
- Infineon Technologies
- Product Category :
- Memory
- Package / Case :
- 64-LBGA
- Memory Format :
- Flash
- Memory Interface :
- Parallel
- JESD-609 Code :
- e0
- Terminal Finish :
- TIN LEAD
- Published :
- 2016
- Memory Density :
- 4294967296 bit
- Surface Mount :
- yes
- HTS Code :
- 8542.32.00.51
- Width :
- 11mm
- Organization :
- 256MX16
- ECCN Code :
- 3A991.B.1.A
- Access Time :
- 110ns
- Length :
- 13mm
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Series :
- GL-P
- Alternate Memory Width :
- 8
- Reach Compliance Code :
- Unknown
- Supply Voltage-Min (Vsup) :
- 3V
- Number of Terminations :
- 64
- Terminal Pitch :
- 1mm
- Terminal Position :
- BOTTOM
- Programming Voltage :
- 3V
- Voltage - Supply :
- 3V~3.6V
- Memory Size :
- 2Gb 256M x 8 128M x 16
- JESD-30 Code :
- R-PBGA-B64
- Operating Temperature :
- -40°C~85°C TA
- RoHS Status :
- ROHS3 Compliant
- Mounting Type :
- Surface Mount
- Supply Voltage-Max (Vsup) :
- 3.6V
- Operating Mode :
- ASYNCHRONOUS
- Number of Functions :
- 1
- Packaging :
- Tape and Reel (TR)
- Supply Voltage :
- 3.3V
- Height Seated (Max) :
- 1.4mm
- Memory Width :
- 16
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Qualification Status :
- Not Qualified
- Peak Reflow Temperature (Cel) :
- 240
- Memory Type :
- Non-Volatile
- Datasheets
- S70GL02GP11FAIR23

Memory Infineon Technologies S70GL02GP11FAIR23 Overview
The Infineon Technologies S70GL02GP11FAIR23 is a cutting-edge 2Gbit FLASH memory chip, designed for high-performance and reliability in a compact 64FBGA package. This IC is tailored to meet the demands of advanced applications requiring large, fast, and durable memory solutions. As a high-density parallel interface memory, the Memory Infineon Technologies S70GL02GP11FAIR23 facilitates quick data access and swift system performance, making it an ideal choice for industries looking to optimize their electronic systems with robust and versatile memory components.
S70GL02GP11FAIR23 Features
The S70GL02GP11FAIR23 FLASH memory chip boasts several key features that make it a top pick for advanced applications. It offers a massive 2Gbit storage capacity, allowing extensive data management and storage solutions. The parallel interface ensures high-speed data transmission, critical for systems requiring rapid access to large amounts of data. The compact 64FBGA packaging not only saves space but also enhances the reliability and durability of the component, ensuring long-term performance in a variety of environmental conditions.
S70GL02GP11FAIR23 Applications
- Embedded Systems: The high storage capacity and fast data access capabilities make it perfect for use in embedded systems, where performance and space economy are crucial.
- Automotive Electronics: Suitable for automotive applications where durability and reliable performance are necessary, especially in harsh environments.
- Mobile Devices: Its compact size and robust performance characteristics are ideal for mobile devices that require large memory capacities without compromising on performance.
- Industrial Automation: The chip's resilience and speed support the demands of industrial automation technologies, facilitating improved processing capabilities in complex systems.
- Networking Equipment: Essential for high-speed networking equipment, allowing for efficient data caching and storage, enhancing overall network performance.
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