S34MS01G200TFB003

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Mfr.Part #
S34MS01G200TFB003
Manufacturer
Infineon Technologies
Package / Case
Datasheet
Download
Description
IC FLASH 1GBIT PARALLEL 48TSOP
Stock
4,514
In Stock :
4,514

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Manufacturer :
Infineon Technologies
Product Category :
Memory
Height Seated (Max) :
1.2mm
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Memory Width :
8
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Screening Level :
AEC-Q100
Programming Voltage :
1.8V
Operating Mode :
ASYNCHRONOUS
Terminal Finish :
Matte Tin (Sn)
Supply Voltage :
1.8V
Organization :
128MX8
Terminal Form :
Gull wing
Number of Functions :
1
Packaging :
Tape and Reel (TR)
Operating Temperature (Max) :
105°C
Memory IC Type :
Flash
Terminal Position :
Dual
JESD-609 Code :
e3
Length :
18.4mm
Width :
12mm
Memory Density :
1073741824 bit
RoHS Status :
RoHS Compliant
Operating Temperature (Min) :
-40°C
Supply Voltage-Min (Vsup) :
1.7V
Temperature Grade :
Industrial
Parallel/Serial :
Parallel
Surface Mount :
yes
JESD-30 Code :
R-PDSO-G48
Supply Voltage-Max (Vsup) :
1.95V
Number of Terminations :
48
Terminal Pitch :
0.5mm
Datasheets
S34MS01G200TFB003
Introducing Memory Infineon Technologies S34MS01G200TFB003 from Chip IC,where excellence meets affordability. This product stands out with its Number of Terminations:48, S34MS01G200TFB003 pinout, S34MS01G200TFB003 datasheet PDF, S34MS01G200TFB003 amp .Beyond Memory Infineon Technologies S34MS01G200TFB003 ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Infineon Technologies S34MS01G200TFB003


Memory2 Inf>ineMemoryon Infineon Technologies S34MS01G200TFB003 Overview Technologies The2>

The Memory Inf Infineonineon Technologies Technologies S S3434MSMS0101GG200200TFTFBB003003 is represents a a cutting-edge cutting flash-edge memory flash device memory designed solution for robust performance and designed by high Inf reliabilityineon Technologies, offering. This IC FLASH robust data 1 storageGB capabilitiesIT. PAR EngineALLELered to48TSOP module support from high Inf-demandine applicationson Technologies provides, this a substantial 1 1 gigGBit parallelabit flash of memory storage capacity, making it IC an ideal is solution for housed applications in requiring a compact large amounts of data48 storageTS in aOP compact package physical, format making. Engine itered ideal for for parallel interface integration, into it a offers variety high of electronic-speed data devices transmission and excellent. data Its integrity reliable, performance essential and for durability both industrial are and tailored to meet commercial the applications. Its rigorous 48-pin TS requirements ofOP modern industrial package ensures and compatibility commercial with applications standard board, ensuring layouts, efficient simpl operationifying and integration long into-term existing reliability designs. > S>S34MS3401MSG01200GTF200BTF003 FeaturesB h

This2 memory> chip

This numerous flash features memory that enhance IC boasts several its efficiency and distinctive features usability that. The make device it highly supports a competitive wide in voltage the market range, ensuring operational stability under varying. It provides a large storage power capacity conditions of. Its1 high G dataBit, transfer which is essential rates for make it suitable data for performance-intensive-c applicationsritical. applications The, parallel while interface the ensures low high-speed power data consumption feature transfer aids in, suitable extending for the systems operational requiring life quick access of battery to-powered stored devices data.. Additionally The, its endurance and 48TSOP data package retention is capabilities designed for are tailored optimal to integration meet into the printed circuit demands of intensive data boards with limited space storage and, retrieval offering operations a, solution making that it combines highly efficiency reliable with compact in multiness-task.

S34MS01G200TFB003p Applications

  • Mobile Devices> : Used in smartphones and tablets to enhance storage capacity without compromising device
  • Embedded Systems: Ideal for use in industrial automation and control systems where robust data storage is required>S to log data and manage operations smoothly. MS 01G <200TFB003 Applications
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    • Consumer Electronics:>< Utilized in devices such as digital cameras and gamingstrong consoles where large, fast storage is necessary for user data and complex> software functionalities.
    • AutomAutomotive Systems: Employed in automotive infototiveainment systems to manage large volumes of data, enhancing user experience Applications with faster access to multimedia content and system updates.
    • :Industrial Automation:strong Integral in control systems where reliability and the ability to handle large> amounts of data quickly are paramount, facilitating smoother operations and increased Employ productivity.
  • Telecommunications: Used in telecommunications equipment to provide robust in data advanced logging driver and-ass firmware storage capabilities, critical for maintaining systemistance performance systems (ADAS) to store firmware and upgrade andability data. for vehicle < safetyli and>. : < Playsli a>< crucialstrong>Consumer role in network infrastructure Electronics,: supporting the storage Integral of configuration in files devices and such software as that digital are cameras, essential for device gaming operation consoles and network management. , data storage is crucial for user content and system updates.
  • Networking Equipment: Helps in managing firmware and configuration data in routers and switches, enhancing the efficiency and reliability of network infrastructure.

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