S29JL032J60BHI323

Manufacturer :

Infineon Technologies

Product Category :

Memory

Ready/Busy :

yes

Operating Temperature :

-40°C~85°C TA

Additional Feature :

BOTTOM BOOT BLOCK

Density :

32 Mb

Operating Supply Voltage :

3.3V

Package / Case :

48-VFBGA

Boot Block :

BOTTOM

Supply Voltage :

3V

Sector Size :

8K64K

Data Polling :

yes

Memory Type :

Non-Volatile

Number of Sectors/Size :

863

JESD-609 Code :

e1

Memory Format :

Flash

Memory Interface :

Parallel

Supply Voltage-Min (Vsup) :

2.7V

Height Seated (Max) :

1mm

Packaging :

Tape and Reel (TR)

Terminal Finish :

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

Mount :

Surface Mount

Toggle Bit :

yes

Terminal Position :

BOTTOM

ECCN Code :

3A991.B.1.A

Memory Width :

16

Terminal Pitch :

0.8mm

Length :

8.15mm

Series :

JL-J

Interface :

Parallel, Serial

Qualification Status :

Not Qualified

Standby Current-Max :

0.000005A

Voltage - Supply :

2.7V~3.6V

Factory Lead Time :

10 Weeks

Organization :

2MX16

Memory Size :

32Mb 4M x 8 2M x 16

Width :

6.15mm

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

HTS Code :

8542.32.00.51

Access Time (Max) :

60 ns

Nominal Supply Current :

16mA

RoHS Status :

ROHS3 Compliant

Number of Functions :

1

Programming Voltage :

3V

Sync/Async :

ASYNCHRONOUS

Mounting Type :

Surface Mount

Number of Pins :

48

Supply Voltage-Max (Vsup) :

3.6V

Alternate Memory Width :

8

Write Cycle Time - Word, Page :

60ns

Number of Terminations :

48