S25FL256SDSBHB213

Manufacturer :

Infineon Technologies

Product Category :

Memory

Organization :

64MX4

Peak Reflow Temperature (Cel) :

NOT SPECIFIED

Terminal Position :

BOTTOM

Memory Interface :

SPI - Quad I/O

HTS Code :

8542.32.00.51

Memory Density :

268435456 bit

Additional Feature :

ALSO CONFIGURABLE AS 256M X 1

Number of Terminations :

24

Write Cycle Time-Max (tWC) :

500ms

Memory Size :

256Mb 32M x 8

Mounting Type :

Surface Mount

Terminal Pitch :

1mm

JESD-30 Code :

R-PBGA-B24

Memory Format :

Flash

RoHS Status :

ROHS3 Compliant

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Alternate Memory Width :

2

Supply Voltage-Min (Vsup) :

2.7V

Number of Functions :

1

Supply Voltage :

3V

Factory Lead Time :

13 Weeks

Time@Peak Reflow Temperature-Max (s) :

NOT SPECIFIED

Height Seated (Max) :

1.2mm

Packaging :

Tape and Reel (TR)

Memory Type :

Non-Volatile

Voltage - Supply :

2.7V~3.6V

Operating Temperature :

-40°C~105°C TA

Parallel/Serial :

Serial

Supply Voltage-Max (Vsup) :

3.6V

Memory Width :

4

Clock Frequency :

80MHz

Operating Mode :

SYNCHRONOUS

Series :

Automotive, AEC-Q100, FL-S

Surface Mount :

yes

Width :

6mm

Length :

8mm

Package / Case :

24-TBGA

Programming Voltage :

3V