S25FL164K0XBHI033

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Mfr.Part #
S25FL164K0XBHI033
Manufacturer
Infineon Technologies
Package / Case
24-TBGA
Datasheet
Download
Description
IC FLASH 64MBIT SPI/QUAD 24BGA
Stock
36,917
In Stock :
36,917

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Manufacturer :
Infineon Technologies
Product Category :
Memory
Supply Voltage-Min (Vsup) :
2.7V
HTS Code :
8542.32.00.51
Word Size :
8B
Clock Frequency :
108MHz
Alternate Memory Width :
2
Terminal Position :
BOTTOM
Package / Case :
24-TBGA
Memory Type :
Non-Volatile
Additional Feature :
ALSO CONFIGURABLE AS 64M X 1
Data Retention Time-Min :
20
Supply Voltage :
3V
Voltage - Supply :
2.7V~3.6V
Nominal Supply Current :
25mA
Memory Interface :
SPI - Quad I/O
Mount :
Surface Mount
Radiation Hardening :
No
Operating Temperature :
-40°C~85°C TA
Packaging :
Tape and Reel (TR)
Max Supply Current :
25mA
Data Bus Width :
8B
JESD-609 Code :
e1
Endurance :
100000 Write/Erase Cycles
Mounting Type :
Surface Mount
Address Bus Width :
24b
Published :
2015
Factory Lead Time :
10 Weeks
Terminal Finish :
TIN SILVER COPPER
Number of Terminations :
24
Interface :
SPI, Serial
Standby Current-Max :
0.000005A
Memory Size :
64Mb 8M x 8
RoHS Status :
ROHS3 Compliant
Sync/Async :
SYNCHRONOUS
Programming Voltage :
3V
Number of Functions :
1
Page Size :
256B
Organization :
16MX4
Memory Format :
Flash
Power Supplies :
3/3.3V
Serial Bus Type :
SPI
Supply Voltage-Max (Vsup) :
3.6V
Series :
FL1-K
Access Time :
8.5 ns
Write Protection :
HARDWARE/SOFTWARE
Terminal Pitch :
1mm
Write Cycle Time - Word, Page :
3ms
Density :
64 Mb
Memory Width :
4
Length :
8mm
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Height Seated (Max) :
1.2mm
Number of Pins :
24
Datasheets
S25FL164K0XBHI033
Introducing Memory Infineon Technologies S25FL164K0XBHI033 from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:24-TBGA, Operating Temperature:-40°C~85°C TA, Mounting Type:Surface Mount, Number of Terminations:24, Number of Pins:24, S25FL164K0XBHI033 pinout, S25FL164K0XBHI033 datasheet PDF, S25FL164K0XBHI033 amp .Beyond Memory Infineon Technologies S25FL164K0XBHI033 ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Infineon Technologies S25FL164K0XBHI033


Memory Infineon Technologies S25FL164K0XBHI033 Overview

The Memory Infineon Technologies S25FL164K0XBHI033 is a high-performance, 64Mbit Flash memory device incorporating the reliability and cutting-edge technology of Infineon Technologies. Engineered for efficiency, this IC FLASH operates via SPI/QUAD interfaces and is encapsulated in a compact 24-BGA package, making it ideal for applications requiring high-speed data storage and retrieval. The product supports a broad voltage range and is characterized by low power consumption, enhancing its applicability in power-sensitive devices. Its robust design and enhanced durability make it particularly suited for B2B customers looking to integrate high-quality memory solutions into their products.

S25FL164K0XBHI033 Features

This 64Mbit Flash memory chip offers high-speed SPI/QUAD communication interfaces, enabling fast read and write capabilities which are essential for real-time applications. The 24-BGA package ensures a minimal footprint, facilitating easier integration into various electronic assemblies. Additionally, the device supports a wide temperature range, making it reliable under extreme environmental conditions.

S25FL164K0XBHI033 Applications

  • Consumer Electronics: Used in smartphones, tablets, and other personal devices for fast and reliable data storage.
  • Automotive Applications: Integrates into automotive infotainment systems, providing durable and consistent performance, critical for vehicle electronics.
  • Industrial Automation: Serves as data logging memory in automation controllers, aiding in efficient process management and operational reliability.
  • Internet of Things (IoT): Essential for IoT devices requiring quick access to stored data to perform tasks efficiently and autonomously.
  • Wearable Technology: Employs in wearable devices, where compact size and low power consumption are critical for device longevity and user comfort.
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