S25FL127SABBHVC03

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Mfr.Part #
S25FL127SABBHVC03
Manufacturer
Infineon Technologies
Package / Case
24-TBGA
Datasheet
Download
Description
IC FLASH 128MBIT SPI/QUAD 24BGA
Stock
44,232
In Stock :
44,232

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Manufacturer :
Infineon Technologies
Product Category :
Memory
RoHS Status :
ROHS3 Compliant
Operating Mode :
SYNCHRONOUS
Surface Mount :
yes
Alternate Memory Width :
2
Serial Bus Type :
SPI
Programming Voltage :
3V
Interface :
SPI, Serial
Terminal Position :
BOTTOM
Packaging :
Tape and Reel (TR)
Memory Interface :
SPI - Quad I/O
Power Supplies :
3/3.3V
Write Protection :
HARDWARE/SOFTWARE
Operating Temperature :
-40°C~105°C TA
Standby Current-Max :
0.0003A
Clock Frequency :
108MHz
Memory Format :
Flash
Height Seated (Max) :
1.2mm
Supply Voltage :
3V
Mounting Type :
Surface Mount
Width :
6mm
Number of Functions :
1
Series :
FL-S
Memory Density :
134217728 bit
Package / Case :
24-TBGA
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Supply Current-Max :
0.063mA
Endurance :
100000 Write/Erase Cycles
HTS Code :
8542.32.00.51
Data Retention Time-Min :
20
Supply Voltage-Max (Vsup) :
3.6V
Number of Terminations :
24
Terminal Pitch :
1mm
Qualification Status :
Not Qualified
Voltage - Supply :
2.7V~3.6V
Memory Type :
Non-Volatile
Organization :
16MX8
Additional Feature :
IT ALSO HAVE MEMORY WIDTH X 1
Memory Width :
8
Length :
8mm
Memory Size :
128Mb 16M x 8
Supply Voltage-Min (Vsup) :
2.7V
Number of Pins :
24
Datasheets
S25FL127SABBHVC03
Introducing Memory Infineon Technologies S25FL127SABBHVC03 from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:-40°C~105°C TA, Mounting Type:Surface Mount, Package / Case:24-TBGA, Number of Terminations:24, Number of Pins:24, S25FL127SABBHVC03 pinout, S25FL127SABBHVC03 datasheet PDF, S25FL127SABBHVC03 amp .Beyond Memory Infineon Technologies S25FL127SABBHVC03 ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Infineon Technologies S25FL127SABBHVC03


Memory Infineon Technologies S25FL127SABBHVC03 Overview

The Memory Infineon Technologies S25FL127SABBHVC03 represents a cutting-edge solution in the realm of solid-state memory technology. Engineered by Infineon Technologies, this IC FLASH memory chip boasts a capacity of 128Mbit with SPI/QUAD interface encapsulated in a compact 24-BGA package. Its robust design and high-speed performance make it an ideal choice for applications requiring reliable and fast data storage and retrieval. The integration of advanced memory technology facilitates enhanced system performance, making it a cornerstone for developing sophisticated electronic systems that demand reliability and efficiency.

S25FL127SABBHVC03 Features

This IC FLASH memory chip offers a multitude of features designed for high performance and durability:

  • 128Mbit Memory Capacity: Ample space for complex firmware and data storage.
  • SPI/QUAD Interface: Flexible and fast data transfer with support for Serial Peripheral Interface and Quad-SPI.
  • 24-BGA Package: Small form factor for space-sensitive applications.
  • High Reliability: Designed to withstand intensive operational demands, ensuring data integrity and longevity.
  • Low Power Consumption: Optimized for energy-efficient operations in portable and embedded devices.

S25FL127SABBHVC03 Applications

  • Consumer Electronics: Used in smartphones, tablets, and other portable devices to store firmware and user data efficiently.
  • Automotive Applications: Integral for managing firmware and data logging in advanced driver-assistance systems (ADAS) and infotainment systems.
  • Industrial Automation: Provides reliable data storage solutions for machinery and process control systems, ensuring robust performance even in harsh environments.
  • Networking Equipment: Facilitates high-speed data transfer and storage in routers, switches, and network controllers.
  • Internet of Things (IoT) Devices: Essential for the storage of operational code and data collection in smart devices interconnected within IoT ecosystems.
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