RMLV0816BGSD-4S2#HA1

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Mfr.Part #
RMLV0816BGSD-4S2#HA1
Manufacturer
Intersil (Renesas Electronics Corporation)
Package / Case
52-TFSOP (0.350, 8.89mm Width)
Datasheet
Download
Description
IC SRAM 8MBIT PARALLEL 52TSOP II
Stock
22,508
In Stock :
22,508

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Manufacturer :
Intersil (Renesas Electronics Corporation)
Product Category :
Memory
Supplier Device Package :
52-TSOP II
Memory Organization :
1M x 8, 512K x 16
Length :
10.79 mm
Package / Case :
52-TFSOP (0.350, 8.89mm Width)
Product Category :
SRAM
Voltage - Supply :
2.4V ~ 3.6V
Product Status :
Active
Mounting Type :
Surface Mount
Technology :
SRAM
Manufacturer :
Renesas Electronics
Brand :
Renesas Electronics
Width :
8.89 mm
Product Type :
SRAM
Base Product Number :
RMLV0816
Operating Temperature :
-40°C ~ 85°C (TA)
RoHS :
Details
Package :
Tape and Reel (TR)
Series :
-
Height :
1 mm
Access Time :
45 ns
Packaging :
Reel
Write Cycle Time - Word, Page :
45ns
Memory Format :
SRAM
Memory Size :
8Mbit
Memory Type :
Volatile
Memory Interface :
Parallel
Subcategory :
Memory and Data Storage
Introducing Memory Intersil (Renesas Electronics Corporation) RMLV0816BGSD-4S2#HA1 from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:52-TFSOP (0.350, 8.89mm Width), Mounting Type:Surface Mount, Operating Temperature:-40°C ~ 85°C (TA), RMLV0816BGSD-4S2#HA1 pinout, RMLV0816BGSD-4S2#HA1 datasheet PDF, RMLV0816BGSD-4S2#HA1 amp .Beyond Memory Intersil (Renesas Electronics Corporation) RMLV0816BGSD-4S2#HA1 ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Intersil (Renesas Electronics Corporation) RMLV0816BGSD-4S2#HA1


Memory Intersil (Renesas Electronics Corporation) RMLV0816BGSD-4S2#HA1 Overview

The Memory Intersil (Renesas Electronics Corporation) RMLV0816BGSD-4S2#HA1 is a high-performance 8Mbit SRAM device, designed using advanced CMOS technology to achieve superior speed and reliability. This IC features a Parallel interface encapsulated in a compact 52TSOP II package, ensuring high density and ease of integration into system designs. Ideal for demanding applications where fast access time and high data integrity are paramount, this SRAM module is tailored to meet the rigorous requirements of contemporary industrial, telecom, and high-end computing environments. By incorporating this Memory Intersil product, businesses can significantly enhance system performance while maintaining cost-effectiveness and scalability.

RMLV0816BGSD-4S2#HA1 Features

The RMLV0816BGSD-4S2#HA1 offers a host of features making it a versatile and indispensable component in advanced electronic systems. Its key features include a large 8Mbit storage capacity, fast access times, and low power consumption. The parallel interface provides straightforward integration with microprocessors and other logic control environments, while the TSOP II 52-pin package ensures a minimal footprint on the PCB, optimizing board real estate.

RMLV0816BGSD-4S2#HA1 Applications

  • Embedded Systems: Integrates seamlessly into embedded architectures for automotive and industrial applications, enhancing data throughput and system reliability.
  • Telecommunications: Utilized in telecom infrastructure to buffer data, helping manage the high-speed processing and storage requirements vital for network reliability and performance.
  • Networking Equipment: Key in routers and switches, where quick data access is crucial for managing bandwidth and optimizing network traffic efficiently.
  • High-Performance Computing: Supports high-speed operations in servers and supercomputers, ensuring efficient data handling and improved overall computational speed.
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