R7S910025CBG#AC0

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Mfr.Part #
R7S910025CBG#AC0
Manufacturer
Intersil (Renesas Electronics Corporation)
Package / Case
320-FBGA
Datasheet
Download
Description
IC MCU 32BIT ROMLESS 320FBGA
Stock
48,376
In Stock :
48,376

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Manufacturer :
Intersil (Renesas Electronics Corporation)
Product Category :
Microcontrollers
RAM Size :
1.5M x 8
Core Size :
32-Bit
Data Converter :
A/D 24x12b
Peripherals :
DMA, POR, PWM, WDT
Number of I/O :
209
Mounting Type :
Surface Mount
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Oscillator Type :
Internal
Factory Lead Time :
20 Weeks
uPs/uCs/Peripheral ICs Type :
MICROPROCESSOR, RISC
Packaging :
Tray
Pin Count :
320
Speed :
450MHz
Operating Temperature :
-40°C~125°C TA
Series :
RZ/T1
Connectivity :
I²C, UART/USART
Program Memory Type :
ROMless
Package / Case :
320-FBGA
Core Processor :
ARM® Cortex®-R4F
Pbfree Code :
yes
Number of Pins :
320
RoHS Status :
ROHS3 Compliant
Voltage - Supply (Vcc/Vdd) :
1.14V~3.6V
Datasheets
R7S910025CBG#AC0
Introducing Microcontrollers Intersil (Renesas Electronics Corporation) R7S910025CBG#AC0 from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Operating Temperature:-40°C~125°C TA, Package / Case:320-FBGA, Number of Pins:320, R7S910025CBG#AC0 pinout, R7S910025CBG#AC0 datasheet PDF, R7S910025CBG#AC0 amp .Beyond Microcontrollers Intersil (Renesas Electronics Corporation) R7S910025CBG#AC0 ,we also offer PIC16F506-I/SL, ATTINY44A-SSN, MS51FB9AE, Our vast inventory has you covered. Contact us now for immediate solutions.

Intersil (Renesas Electronics Corporation) R7S910025CBG#AC0


Microcontrollers Intersil (Renesas Electronics Corporation) R7S910025CBG#AC0 Overview

The Microcontrollers Intersil (Renesas Electronics Corporation) R7S910025CBG#AC0 represents a state-of-the-art microcontroller unit (MCU) designed to cater to sophisticated applications requiring high-performance processing and versatile interfacing options. This 32-bit MCU is built on advanced technology that supports a wide range of applications, thanks to its ROMless configuration which allows designers to customize memory solutions according to specific needs. Its packaging in a 320FBGA (Fine-pitch Ball Grid Array) enables robust physical integration while maintaining a compact footprint, essential for space-constrained applications. The flexibility and powerful capabilities of the R7S910025CBG#AC0 make it an ideal choice for developing advanced electronics that require high-speed operations and multi-functional processing.

R7S910025CBG#AC0 Features

This MCU boasts a robust set of features designed for complex digital computations and connectivity:

  • 32-bit Processing Core: Ensures efficient handling of complex algorithms and processes.
  • ROMless Configuration: Provides flexibility in choosing external memory types and capacities, allowing for tailored system designs.
  • 320FBGA Packaging: Offers a compact, space-efficient solution without compromising on performance or reliability.
  • High Integration Capability: Facilitates the inclusion of multiple functions within a single chip, reducing overall system costs and enhancing reliability.

R7S910025CBG#AC0 Applications

  • Automotive Systems: Utilized in engine management systems and infotainment units, enhancing both performance and reliability.
  • Industrial Automation: Drives complex machinery and control systems, enabling higher productivity and more efficient process control.
  • Consumer Electronics: Powers a wide range of devices such as smart home systems and portable electronics, providing robust operation and connectivity.
  • Medical Devices: Used in medical diagnostic equipment, where precision and reliability are paramount.
  • Telecommunication Infrastructure: Supports the backbone of communication systems, ensuring robust data processing and management.
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