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  6. QMS-032-06.75-L-D-PT8
QMS-032-06.75-L-D-PT8

QMS-032-06.75-L-D-PT8

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Mfr.Part #
QMS-032-06.75-L-D-PT8
Manufacturer
Samtec, Inc.
Package / Case
Datasheet
Download
Description
CONN HDR 64POS SMD GOLD
Stock
38,843
In Stock ：
38,843

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Manufacturer :
Samtec, Inc.
Product Category :
Arrays, Edge Type, Mezzanine (Board to Board)
Packaging :
Tray
RoHS Status :
ROHS3 Compliant
Series :
Power Q2™ QMS
Contact Finish Thickness :
10.0μin 0.25μm
Contact Finish :
Gold
Connector Type :
Header, Outer Shroud Contacts
Number of Rows :
2
Height Above Board :
0.250 6.35mm
Pitch :
0.025 0.64mm
Stack Height (Mating) :
11mm 13mm
Factory Lead Time :
3 Weeks
Number of Positions :
72 (64 + 8 Power)
Mounting Type :
Surface Mount, Through Hole
Feature :
Board Guide, Ground Bus (Plane), Power Pins (16)
Introducing Arrays, Edge Type, Mezzanine (Board to Board) Samtec, Inc. QMS-032-06.75-L-D-PT8 from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type：Surface Mount, Through Hole, QMS-032-06.75-L-D-PT8 pinout, QMS-032-06.75-L-D-PT8 datasheet PDF, QMS-032-06.75-L-D-PT8 amp .Beyond Arrays, Edge Type, Mezzanine (Board to Board) Samtec, Inc. QMS-032-06.75-L-D-PT8 ,we also offer 5054761010, 5035481222, AXT510124, Our vast inventory has you covered. Contact us now for immediate solutions.



Header, Outer Shroud Contacts Tray 2 Rows 0.025 0.64mm Surface Mount, Through Hole 72 (64 + 8 Power) Positions Power Q2™ QMS Gold

QMS-032-06.75-L-D-PT8 Overview


The product comes in a package of Header, Outer Shroud Contacts.To package the product, a Tray case is used.Surface Mount, Through Hole is the type of mounting for the device.The product is a member of the Power Q2™ QMS Series.It is possible to maintain Board Guide, Ground Bus (Plane), Power Pins (16) while the system is operating.

QMS-032-06.75-L-D-PT8 Features


Power Q2™ QMS series
Package / Case: Tray
Mounting Type:Surface Mount, Through Hole


QMS-032-06.75-L-D-PT8 Applications


There are a lot of Samtec Inc.
QMS-032-06.75-L-D-PT8 Rectangular Connectors applications.


  • Embedded systems
  • Datacom
  • Communication
  • Medical technology
  • Military Technology
  • Measuring & Control Technology
  • Instrumentation
  • Automotive Electronics
  • Telecommunications
  • Data Technology
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