QMS-016-06.75-H-D-DP-PC4
- Mfr.Part #
- QMS-016-06.75-H-D-DP-PC4
- Manufacturer
- Samtec, Inc.
- Package / Case
- Datasheet
- Download
- Description
- CONN DIFF ARRAY PLG 32P SMD GOLD
- Stock
- 29,045
- In Stock :
- 29,045
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- Manufacturer :
- Samtec, Inc.
- Product Category :
- Arrays, Edge Type, Mezzanine (Board to Board)
- Mounting Type :
- Surface Mount, Through Hole
- Termination :
- Solder
- Pitch :
- 0.025 0.64mm
- Number of Positions :
- 40 (32 + 8 Power)
- Feature :
- Board Guide, Ground Bus (Plane), Power Pins (8)
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- RoHS Status :
- ROHS3 Compliant
- Number of Rows :
- 2
- Packaging :
- Tray
- Stack Height (Mating) :
- 11mm 13mm
- Mount :
- Through Hole
- Radiation Hardening :
- No
- Connector Type :
- Differential Pair Array, Male
- Contact Finish :
- Gold
- Contact Finish Thickness :
- 30.0μin 0.76μm
- Height Above Board :
- 0.250 6.35mm
- Factory Lead Time :
- 3 Weeks
- Gender :
- Male
- Series :
- Power Q2™ QMS
- Datasheets
- QMS-016-06.75-H-D-DP-PC4
Differential Pair Array, Male Tray 2 Rows 0.025 0.64mm Surface Mount, Through Hole 40 (32 + 8 Power) Positions Power Q2™ QMS Gold Solder
QMS-016-06.75-H-D-DP-PC4 Overview
Packaging is in the form of Differential Pair Array, Male.An orange Tray case is used to package the product.This device has a Surface Mount, Through Hole mounting type.Specifically, it is one of the products in the Power Q2™ QMS Series.In operation, Board Guide, Ground Bus (Plane), Power Pins (8) can be maintained as long as Board Guide, Ground Bus (Plane), Power Pins (8) is unchanged.A Through Hole socket is required for the mounting of this part.
QMS-016-06.75-H-D-DP-PC4 Features
Power Q2™ QMS series
Package / Case: Tray
Mounting Type:Surface Mount, Through Hole
QMS-016-06.75-H-D-DP-PC4 Applications
There are a lot of Samtec Inc.
QMS-016-06.75-H-D-DP-PC4 Rectangular Connectors applications.
- Embedded systems
- Datacom
- Communication
- Medical technology
- Military Technology
- Measuring & Control Technology
- Instrumentation
- Automotive Electronics
- Telecommunications
- Data Technology
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