PMLL4153,115

Manufacturer :

NXP Semiconductors

Product Category :

Unclassified

Number of Elements :

1

Max Operating Temperature :

200°C

Radiation Hardening :

No

Packaging :

Tape and Reel (TR)

Lead Free :

Lead Free

Mount :

Surface Mount

Package / Case :

DO-213AC, MINI-MELF, SOD-80

Max Reverse Leakage Current :

50nA

Min Operating Temperature :

-65°C

Terminal Form :

WRAP AROUND

Diode Element Material :

SILICON

Mounting Type :

Surface Mount

Diode Type :

Standard

Peak Reverse Current :

50nA

Operating Temperature - Junction :

200°C Max

Peak Non-Repetitive Surge Current :

4A

Forward Voltage :

880mV

Number of Terminations :

2

Case Connection :

Isolated

Recovery Time :

4 ns

Power Dissipation :

500mW

Speed :

Small Signal =< 200mA (Io), Any Speed

ECCN Code :

EAR99

Base Part Number :

LL4153

Capacitance @ Vr, F :

2pF @ 0V 1MHz

Forward Current :

200mA

Max Surge Current :

4A

HTS Code :

8541.10.00.70

Max Repetitive Reverse Voltage (Vrrm) :

75V

Terminal Position :

END

Number of Pins :

2

Average Rectified Current :

200mA

Current - Reverse Leakage @ Vr :

50nA @ 50V

Published :

2010

Reverse Recovery Time :

4 ns

RoHS Status :

ROHS3 Compliant

Max Reverse Voltage (DC) :

50V

Reference Standard :

IEC-60134

Pin Count :

2

Current - Average Rectified (Io) :

200mA DC

Contact Plating :

Tin

Moisture Sensitivity Level (MSL) :

1 (Unlimited)

Factory Lead Time :

6 Weeks

Voltage - Forward (Vf) (Max) @ If :

880mV @ 50mA

JESD-609 Code :

e3

Element Configuration :

Single