PMEG2005EL,315

Manufacturer :

NXP Semiconductors

Product Category :

Unclassified

Terminal Position :

BOTTOM

Peak Reflow Temperature (Cel) :

260

Speed :

Fast Recovery =< 500ns, > 200mA (Io)

Published :

2003

Output Current-Max :

0.5A

Mounting Type :

Surface Mount

HTS Code :

8541.10.00.50

Packaging :

Tape and Reel (TR)

Current - Average Rectified (Io) :

500mA DC

Terminal Finish :

Tin (Sn)

Qualification Status :

Not Qualified

Diode Element Material :

SILICON

Forward Current :

500mA

Operating Temperature (Max) :

150°C

Voltage - Forward (Vf) (Max) @ If :

500mV @ 500mA

Moisture Sensitivity Level (MSL) :

1 (Unlimited)

Time@Peak Reflow Temperature-Max (s) :

40

Factory Lead Time :

8 Weeks

Pin Count :

2

Current - Reverse Leakage @ Vr :

30μA @ 10V

Number of Terminations :

2

JESD-609 Code :

e3

Base Part Number :

PMEG2005

Configuration :

Single

Number of Pins :

2

Capacitance @ Vr, F :

30pF @ 1V 1MHz

Number of Elements :

1

Diode Type :

Schottky

Package / Case :

SOD-882

ECCN Code :

EAR99

Terminal Form :

NO LEAD

Surface Mount :

yes

Operating Temperature - Junction :

-65°C~150°C

Voltage - DC Reverse (Vr) (Max) :

20V

RoHS Status :

ROHS3 Compliant