PMBD6050,215

Manufacturer :

NXP Semiconductors

Product Category :

Unclassified

Published :

2009

Time@Peak Reflow Temperature-Max (s) :

30

Forward Current :

215mA

Voltage - DC Reverse (Vr) (Max) :

70V

Voltage - Forward (Vf) (Max) @ If :

1.25V @ 150mA

HTS Code :

8541.10.00.70

RoHS Status :

ROHS3 Compliant

Packaging :

Tape and Reel (TR)

ECCN Code :

EAR99

Reverse Recovery Time :

4ns

Number of Elements :

1

Mounting Type :

Surface Mount

Moisture Sensitivity Level (MSL) :

1 (Unlimited)

Rep Pk Reverse Voltage-Max :

85V

Factory Lead Time :

4 Weeks

Terminal Position :

Dual

Diode Element Material :

SILICON

Terminal Finish :

Tin (Sn)

Current - Reverse Leakage @ Vr :

100nA @ 50V

Number of Pins :

3

Pin Count :

3

Operating Temperature (Max) :

150°C

Operating Temperature - Junction :

150°C Max

JESD-609 Code :

e3

Base Part Number :

PMBD6050

Surface Mount :

yes

Output Current-Max :

0.215A

Current - Average Rectified (Io) :

215mA DC

Terminal Form :

Gull wing

Package / Case :

TO-236-3, SC-59, SOT-23-3

Speed :

Fast Recovery =< 500ns, > 200mA (Io)

Capacitance @ Vr, F :

1.5pF @ 0V 1MHz

Peak Reflow Temperature (Cel) :

260

Configuration :

Single

Power Dissipation-Max :

0.25W

Diode Type :

Standard

Number of Terminations :

3