PM5324-FEI

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Mfr.Part #
PM5324-FEI
Manufacturer
Microchip Technology
Package / Case
FCBGA
Datasheet
Download
Description
IC TELECOM INTERFACE 1292FCBGA
Stock
34,672
In Stock :
34,672

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Manufacturer :
Microchip Technology
Product Category :
Telecom
Interface :
SFI-4
Voltage - Supply :
1.2V
Packaging :
Tray
Base Product Number :
PM5324
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
RoHS :
Details
Mounting Type :
Surface Mount
Supplier Device Package :
1292-FCBGA
RoHS Status :
ROHS3 Compliant
Manufacturer :
Microchip
Function :
SONET/SDH
Package / Case :
FCBGA
Product Type :
Telecom Interface ICs
Data Rate :
10 Gbps
Subcategory :
Interface ICs
Series :
-
Package :
Tray
Operating Temperature :
-
Product Status :
Active
Brand :
Microchip Technology
Product Category :
Telecom Interface ICs
Current - Supply :
-
Datasheets
PM5324-FEI
Introducing Telecom Microchip Technology PM5324-FEI from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Package / Case:FCBGA, Operating Temperature:-, PM5324-FEI pinout, PM5324-FEI datasheet PDF, PM5324-FEI amp .Beyond Telecom Microchip Technology PM5324-FEI ,we also offer CPC5712UTR, MT8870DS1, SI32176-C-FM1R, Our vast inventory has you covered. Contact us now for immediate solutions.



Telecom device

PM5324-FEI Overview


Space is saved on the board by using the FCBGA package.Telecommunications equipment is packed according to Tray's method.In this case, Surface Mount is the mounting type.Wtelecom IC's efficiencyh a high supply voltage, 1.2V can be operated more efficiently.Operating temperatures of - can ensure reliable performance.The current supply is -.This is a Interface ICs subcategory.The - series is capable of providing a number of similar functions to the W series.

PM5324-FEI Features


Available in the FCBGA package


PM5324-FEI Applications


There are a lot of Microchip Technology
PM5324-FEI Telecom applications.


  • Channel Service Units (CSUs): T1/E1/J1
  • Fractional T1/E1/J1
  • BITS Timing
  • Digital Access Cross-connect System (DACs)
  • Digital Cross-connect Systems (DCS)
  • Frame Relay Switches and Access Devices (FRADS)
  • ISDN Primary Rate Interfaces (PRA)
  • PBXs channel bank
  • PCM channel bank
  • T3 channelized access concentrators
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