PIC24FJ512GB606-E/MR
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- Mfr.Part #
- PIC24FJ512GB606-E/MR
- Manufacturer
- Microchip Technology
- Package / Case
- 64-VFQFN Exposed Pad
- Datasheet
- Download
- Description
- IC MCU 16BIT 512KB FLASH 64QFN
- Stock
- 10,167
- In Stock ：
- 10,167
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- Manufacturer :
- Microchip Technology
- Product Category :
- Microcontrollers
- Mounting Type :
- Surface Mount
- Supplier Device Package :
- 64-QFN (9x9)
- Subcategory :
- Microcontrollers - MCU
- Brand :
- Microchip Technology
- PWM Channels :
- yes
- Core Processor :
- PIC
- RAM Size :
- 32K x 8
- Supply Voltage-Min (Vsup) :
- 2V
- Manufacturer :
- Microchip
- Maximum Operating Temperature :
- + 85 C
- Interface Type :
- I2C, I2S, SPI, UART
- Height Seated (Max) :
- 0.9mm
- Factory Lead Time :
- 7 Weeks
- On Chip Program ROM Width :
- 8
- Connectivity :
- CANbus, I2C, IrDA, LINbus, SPI, UART/USART
- Series :
- Automotive, AEC-Q100, PIC® 24F
- Terminal Position :
- QUAD
- Additional Feature :
- ITS ALSO AVAILABLE WITH 16-CH 10-BIT
- Number of Terminations :
- 64
- Address Bus Width :
- 16
- Program Memory Type :
- Flash
- Clock Frequency :
- 32MHz
- uPs/uCs/Peripheral ICs Type :
- MICROCONTROLLER
- Program Memory Size :
- 512KB 170K x 24
- ROM (words) :
- 524288
- Supply Voltage-Max (Vsup) :
- 3.6V
- Base Product Number :
- PIC24FJ512GB606
- Minimum Operating Temperature :
- - 40 C
- Core Size :
- 16-Bit
- Speed :
- 32MHz
- Peripherals :
- Brown-out Detect/Reset, DMA, HLVD, POR, PWM, WDT
- Operating Temperature :
- -40°C~125°C TA
- Surface Mount :
- yes
- HTS Code :
- 8542.31.00.01
- Tradename :
- PIC
- Screening Level :
- ISO/TS-16949
- Product Status :
- Active
- Number of I/O :
- 53
- Supply Voltage :
- 3.3V
- Data Converter :
- A/D 16x12b SAR
- Product Type :
- 16-bit Microcontrollers - MCU
- Product Category :
- 16-bit Microcontrollers - MCU
- External Data Bus Width :
- 8
- Number of I/Os :
- 53 I/O
- Length :
- 9mm
- Width :
- 9mm
- RoHS :
- Details
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Package / Case :
- 64-VFQFN Exposed Pad
- DMA Channels :
- yes
- RoHS Status :
- ROHS3 Compliant
- Terminal Pitch :
- 0.5mm
- Bit Size :
- 16
- Voltage - Supply (Vcc/Vdd) :
- 2V~3.6V
- Terminal Form :
- NO LEAD
- EEPROM Size :
- -
- Number of ADC Channels :
- 16 Channel
- Oscillator Type :
- Internal
- Data Bus Width :
- 16 bit
- JESD-30 Code :
- S-PQCC-N64
- Data Converters :
- A/D 16x12b SAR
- DAC Channels :
- No
- Number of Timers/Counters :
- 7 Timer
- Mounting Style :
- SMD/SMT
- RAM (bytes) :
- 32768
- Product :
- MCU
- Packaging :
- Tube
- Package :
- Tube
- Has ADC :
- yes
- Datasheets
- PIC24FJ512GB606-E/MR
Microcontrollers Microchip Technology PIC24FJ512GB606-E/MR Overview
The Microcontrollers Microchip Technology PIC24FJ512GB606-E/MR is a high-performance, 16-bit microcontroller designed to offer an efficient, versatile solution for a wide range of embedded applications. Manufactured by Microchip Technology, this MCU is built on a robust architecture that supports complex digital signal processing and control tasks. With a substantial 512KB of flash memory and a variety of peripherals, this microcontroller is ideal for developers seeking a balance of power and usability in their design projects.
PIC24FJ512GB606-E/MR Features
This MCU is equipped with numerous features that enhance its functionality and flexibility. It supports USB OTG for direct device connections, has a DMA controller for improved data management, and features several timers for precise event management. Security and communication are bolstered by its cryptographic engine and a variety of serial communication options, including I2C, SPI, and UART interfaces.
PIC24FJ512GB606-E/MR Applications
- Consumer Electronics: Utilized in devices like smart home systems where efficient data handling and interfacing with various sensors and actuators are required.
- Automotive Systems: Employs its robust processing capabilities for automotive applications, such as advanced driver-assistance systems (ADAS) where reliability and performance are crucial.
- Industrial Automation: Applied in machine control systems, benefiting from its high integration and support for multiple communication protocols to manage complex tasks.
- Medical Devices: Used in medical monitoring systems, leveraging its low power consumption and large memory for critical data storage and real-time processing.
- Communication Infrastructure: Integral to telecommunications equipment, where its enhanced communication features facilitate improved data throughput and reliability.
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