PIC18LF27K40-E/SP

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Mfr.Part #
PIC18LF27K40-E/SP
Manufacturer
Microchip Technology
Package / Case
28-DIP (0.300, 7.62mm)
Datasheet
Download
Description
IC MCU 8BIT 128KB FLASH 28SPDIP
Stock
1,109
In Stock :
1,109

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Manufacturer :
Microchip Technology
Product Category :
Microcontrollers
RoHS Status :
ROHS3 Compliant
Peripherals :
Brown-out Detect/Reset, LVD, POR, PWM, WDT
Product Category :
8-bit Microcontrollers - MCU
Clock Frequency :
64MHz
Number of I/O :
25
Packaging :
Tube
PWM Channels :
yes
Supply Voltage-Max (Vsup) :
3.6V
Manufacturer :
Microchip
Package :
Tube
Voltage - Supply (Vcc/Vdd) :
1.8V~3.6V
uPs/uCs/Peripheral ICs Type :
MICROCONTROLLER, RISC
Speed :
64MHz
Supply Voltage :
3.3V
Number of I/Os :
25 I/O
Surface Mount :
No
Product Type :
8-bit Microcontrollers - MCU
Series :
PIC® XLP™ 18K
Connectivity :
I2C, LINbus, SPI, UART/USART
Width :
7.62mm
DAC Channels :
yes
Program Memory Type :
Flash
RAM Size :
3.6K x 8
Base Product Number :
PIC18LF27
Terminal Position :
Dual
Mounting Style :
Through Hole
Maximum Operating Temperature :
+ 125 C
Length :
34.671mm
JESD-30 Code :
R-PDIP-T28
Screening Level :
TS 16949
Additional Feature :
OPERATES AT 1.8 V MINIMUM SUPPLY AT 16 MHZ
EEPROM Size :
1K x 8
Tradename :
PIC
On Chip Program ROM Width :
8
Data Converter :
A/D 24x10b; D/A 1x5b
Height Seated (Max) :
5.08mm
Base Part Number :
PIC18LF27K40
Oscillator Type :
Internal
Minimum Operating Temperature :
- 40 C
Program Memory Size :
128KB 64K x 16
Terminal Pitch :
2.54mm
Moisture Sensitivity Level (MSL) :
Not Applicable
Product Status :
Active
Core Size :
8-Bit
Supplier Device Package :
28-SPDIP
Package / Case :
28-DIP (0.300, 7.62mm)
Bit Size :
16
Mounting Type :
Through Hole
Data Converters :
A/D 24x10b; D/A 1x5b
Operating Temperature :
-40°C~125°C TA
Number of Terminations :
28
HTS Code :
8542.31.00.01
Brand :
Microchip Technology
RoHS :
Details
Factory Lead Time :
6 Weeks
Subcategory :
Microcontrollers - MCU
Has ADC :
yes
Supply Voltage-Min (Vsup) :
3V
Published :
2017
DMA Channels :
No
Data Bus Width :
8 bit
Core Processor :
PIC
Datasheets
PIC18LF27K40-E/SP
Introducing Microcontrollers Microchip Technology PIC18LF27K40-E/SP from Chip IC,where excellence meets affordability. This product stands out with its Base Part Number:PIC18LF27K40, Package / Case:28-DIP (0.300, 7.62mm), Mounting Type:Through Hole, Operating Temperature:-40°C~125°C TA, Number of Terminations:28, PIC18LF27K40-E/SP pinout, PIC18LF27K40-E/SP datasheet PDF, PIC18LF27K40-E/SP amp .Beyond Microcontrollers Microchip Technology PIC18LF27K40-E/SP ,we also offer PIC16F506-I/SL, ATTINY44A-SSN, MS51FB9AE, Our vast inventory has you covered. Contact us now for immediate solutions.

Microchip Technology PIC18LF27K40-E/SP


Microcontrollers Microchip Technology PIC18LF27K40-E/SP Overview

The Microcontrollers Microchip Technology PIC18LF27K40-E/SP is a powerful and versatile 8-bit microcontroller designed to cater to a wide array of applications requiring efficient power management and robust operation in challenging environments. This MCU is built on Microchip's advanced technology, offering 128KB of flash memory, which provides substantial room for application code and data storage. Ideal for developers looking for a balance between performance and cost, this device features a flexible clock system, extensive communication capabilities, and a low-power design suited for battery-operated and power-sensitive applications.

PIC18LF27K40-E/SP Features

  • 8-bit microcontroller with 128KB Flash memory
  • Extended operating voltage range (1.8V to 3.6V)
  • Low power consumption modes for energy efficiency
  • Enhanced Mid-range Core with 49 Instruction, 16 Stack Levels
  • Comprehensive peripheral set including SPI, I2C, USART, and more
  • Flexible Oscillator Structure with PLL capabilities
  • 28-pin SPDIP package, suitable for prototyping and mass production

PIC18LF27K40-E/SP Applications

  • Industrial Automation: Utilized in controlling sensors and actuators, providing reliable operation in factory environments.
  • Consumer Electronics: Powers advanced user interfaces and connectivity in devices such as smart watches and fitness trackers.
  • Automotive Applications: Employed in vehicle monitoring systems, enhancing safety and performance metrics.
  • Home Automation Systems: Integral in smart home devices, facilitating communication and control capabilities.
  • Medical Devices: Supports functionalities in portable medical equipment, ensuring low power consumption and high reliability.
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