PIC18F13K22-E/ML
- Mfr.Part #
- PIC18F13K22-E/ML
- Manufacturer
- Microchip Technology
- Package / Case
- 20-VFQFN Exposed Pad
- Datasheet
- Download
- Description
- IC MCU 8BIT 8KB FLASH 20QFN
- Stock
- 4,786
- In Stock :
- 4,786
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- Manufacturer :
- Microchip Technology
- Product Category :
- Microcontrollers
- Product Status :
- Active
- Radiation Hardening :
- No
- Operating Supply Voltage (Typ) :
- 2.5/3.3/5(V)
- Qualification :
- AEC-Q100
- Product Category :
- 8-bit Microcontrollers - MCU
- Number of Programmable I/O :
- 18
- Max Power Dissipation :
- 800mW
- Watchdog Timer :
- yes
- JESD-609 Code :
- e3
- Speed :
- 48MHz
- Supplier Device Package :
- 20-QFN (4x4)
- Product :
- MCU
- Operating Temperature (Min) :
- -40C
- Instruction Set Architecture :
- RISC
- Has ADC :
- yes
- Number of I/O :
- 17
- # I/Os (Max) :
- 18
- Number of ADC Channels :
- 12 Channel
- Maximum Operating Temperature :
- + 125 C
- Supply Voltage-Min (Vsup) :
- 2.7V
- Clock Freq :
- 48(MHz)
- Pbfree Code :
- yes
- Height :
- 0.88 mm
- uPs/uCs/Peripheral ICs Type :
- MICROCONTROLLER, RISC
- Bit Size :
- 16
- Number of Timers - General Purpose :
- 4
- RoHS :
- Details
- Operating Temp Range :
- -40C to 125C
- Interfaces :
- I2C/SPI/USART
- Core Size :
- 8-Bit
- RoHS Status :
- ROHS3 Compliant
- On Chip Program ROM Width :
- 16
- Brand :
- Microchip Technology / Atmel
- Program Memory Size :
- 8KB 4K x 16
- EEPROM Size :
- 256 x 8
- Frequency :
- 48MHz
- Width :
- 4 mm
- Product Type :
- 8-bit Microcontrollers - MCU
- Package / Case :
- 20-VFQFN Exposed Pad
- Core Processor :
- PIC
- Height Seated (Max) :
- 1mm
- Number of Pins :
- 20
- Program Memory Type :
- Flash
- Length :
- 4 mm
- Package :
- Tube
- Number of Timers/Counters :
- 4
- Connectivity :
- I2C, LINbus, SPI, UART/USART
- Supply Current-Max :
- 15.6mA
- Interface Type :
- I2C/SPI/USART
- Minimum Operating Temperature :
- - 40 C
- Pin Count :
- 20
- Tradename :
- PIC
- Manufacturer :
- Microchip
- Voltage - Supply (Vcc/Vdd) :
- 2.3V~5.5V
- Data Bus Width :
- 8B
- RAM Size :
- 256 x 8
- Oscillator Type :
- Internal
- Base Product Number :
- PIC18F13
- Total Internal Ram Size :
- 256B(kB)
- Interface :
- I2C, LIN, SPI, UART, USART
- Rad Hardened :
- No
- Series :
- PIC® XLP™ 18K
- Package Type :
- QFN EP
- Terminal Position :
- QUAD
- Operating Supply Voltage (Max) :
- 5.5(V)
- Programmable :
- yes
- Data Converter :
- A/D 12x10b
- DMA Channels :
- No
- Number of Terminations :
- 20
- Mount :
- Surface Mount
- Factory Lead Time :
- 6 Weeks
- Peak Reflow Temperature (Cel) :
- 260
- Number of I/Os :
- 17 I/O
- CPU Family :
- PIC
- Mounting Style :
- SMD/SMT
- Supply Voltage-Max (Vsup) :
- 5.5V
- ECCN Code :
- 3A991.A.2
- Memory Size :
- 8kB
- Maximum Expanded Memory Size :
- 2MB
- Supply Voltage :
- 3.6V
- DAC Channels :
- yes
- Operating Temperature Classification :
- Automotive
- MSL :
- MSL 1 - Unlimited
- Power Supplies :
- 2/5V
- Data Converters :
- A/D 12x10b
- Device Core :
- PIC
- Terminal Pitch :
- 0.5mm
- Base Part Number :
- PIC18F13K22
- Published :
- 2008
- Peripherals :
- Brown-out Detect/Reset, POR, PWM, WDT
- Mounting :
- Surface Mount
- Operating Temperature :
- -40°C~125°C TA
- Mounting Type :
- Surface Mount
- Power Dissipation (Max) :
- 800(mW)
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- Operating Supply Voltage (Min) :
- 1.8/2.7(V)
- Operating Temperature (Max) :
- 125C
- Packaging :
- Tube
- Time@Peak Reflow Temperature-Max (s) :
- 40
- PWM Channels :
- yes
- Terminal Finish :
- Matte Tin (Sn) - annealed
- Device Core Size :
- 8(b)
- Datasheets
- PIC18F13K22-E/ML
PIC18F13K22-E/ML Documents

2C interfaces. These functionalities are critical for developers looking to integrate robust communication protocols and precise control in their designs.
PIC18F13K22-E/ML Applications
- Consumer Electronics: Utilized in home automation systems and entertainment devices, the PIC18F13K22-E/ML enables responsive controls and connectivity, enhancing user interaction and functionality.
- Automotive Applications: Integral in developing automotive subsystems such as small engine management and body control modules, this MCU offers the necessary processing power and environmental tolerance.
- Industrial Control: Powers complex machinery controls, providing the computational capabilities required for sensor management, operational control, and safety mechanisms in industrial environments.
- Medical Devices: Used in portable medical diagnostics and monitoring equipment, where its low power consumption and high integration support critical health technology advancements.
- Communication Systems: Applied in communication peripherals, such as wireless modems and optical network units, ensuring efficient data handling and protocol compliance.
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