PIC16C72-04E/SP

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Mfr.Part #
PIC16C72-04E/SP
Manufacturer
Microchip Technology
Package / Case
28-DIP (0.300, 7.62mm)
Datasheet
Download
Description
IC MCU 8BIT 3.5KB OTP 28SPDIP
Stock
12,735
In Stock :
12,735

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Manufacturer :
Microchip Technology
Product Category :
Microcontrollers
Surface Mount :
No
Number of Pins :
28
JESD-609 Code :
e3
Height Seated (Max) :
4.572mm
Data Converters :
A/D 5x8b
Supply Current-Max :
5mA
Watchdog Timer :
yes
Published :
1997
RAM Size :
128 x 8
Memory Size :
2kB
Terminal Finish :
Matte Tin (Sn)
Packaging :
Tube
EEPROM Size :
-
Oscillator Type :
External
Program Memory Size :
3.5KB 2K x 14
ROM (words) :
2048
Supply Voltage :
5V
Bit Size :
8
RoHS Status :
ROHS3 Compliant
Terminal Pitch :
2.54mm
Series :
PIC® 16C
Frequency :
4MHz
Package / Case :
28-DIP (0.300, 7.62mm)
CPU Family :
PIC
Package :
Tube
Data Converter :
A/D 5x8b
Core Size :
8-Bit
Max Power Dissipation :
1W
Number of I/O :
22
Supply Voltage-Max (Vsup) :
6V
uPs/uCs/Peripheral ICs Type :
MICROCONTROLLER, RISC
Program Memory Type :
OTP
Base Part Number :
PIC16C72
Base Product Number :
PIC16C72
DMA Channels :
No
Supplier Device Package :
28-SPDIP
Peripherals :
Brown-out Detect/Reset, POR, PWM, WDT
Radiation Hardening :
No
Power Supplies :
5V
Mounting Type :
Through Hole
Pbfree Code :
yes
Moisture Sensitivity Level (MSL) :
Not Applicable
On Chip Program ROM Width :
14
Number of Timers/Counters :
3
Lead Free :
Lead Free
Has ADC :
yes
Number of Terminations :
28
Terminal Position :
Dual
Product Status :
Obsolete
DAC Channels :
No
Memory Type :
EPROM
Connectivity :
I2C, SPI
Data Bus Width :
8B
Pin Count :
28
Core Processor :
PIC
PWM Channels :
yes
Voltage - Supply (Vcc/Vdd) :
4V~6V
Supply Voltage-Min (Vsup) :
4V
Speed :
4MHz
Operating Temperature :
-40°C~125°C TA
Interface :
I2C, SPI, SSP
Datasheets
PIC16C72-04E/SP
Introducing Microcontrollers Microchip Technology PIC16C72-04E/SP from Chip IC,where excellence meets affordability. This product stands out with its Number of Pins:28, Package / Case:28-DIP (0.300, 7.62mm), Base Part Number:PIC16C72, Mounting Type:Through Hole, Number of Terminations:28, Operating Temperature:-40°C~125°C TA, PIC16C72-04E/SP pinout, PIC16C72-04E/SP datasheet PDF, PIC16C72-04E/SP amp .Beyond Microcontrollers Microchip Technology PIC16C72-04E/SP ,we also offer PIC16F506-I/SL, ATTINY44A-SSN, MS51FB9AE, Our vast inventory has you covered. Contact us now for immediate solutions.

Microchip Technology PIC16C72-04E/SP


Microcontrollers Microchip Technology PIC16C72-04E/SP Overview

The Microcontrollers Microchip Technology PIC16C72-04E/SP is a robust 8-bit microcontroller unit (MCU) from Microchip Technology, designed for advanced control applications. With 3.5KB of OTP memory, this versatile chip offers a solid platform for developing multifunctional devices in various industrial applications. The PIC16C72-04E/SP is encased in a 28-pin SPDIP package, providing ample I/O options and flexibility for complex circuit designs. Its reliable performance and adaptability make it an ideal choice for developers looking to create sophisticated systems with a compact MCU footprint.

PIC16C72-04E/SP Features

  • 8-bit microcontroller architecture for efficient processing.
  • 3.5KB of OTP memory for program storage.
  • 28-pin SPDIP package for easy integration into various designs.
  • Low power consumption suitable for battery-operated devices.
  • Wide range of interfacing capabilities, enhancing connectivity.

PIC16C72-04E/SP Applications

  • Home Automation Systems: Utilized in devices such as smart thermostats and security systems, providing reliable performance and connectivity.
  • Automotive Electronics: Suitable for applications like engine management and infotainment systems due to its robust processing capabilities.
  • Consumer Electronics: Powers a variety of household gadgets, ensuring optimal efficiency and interfacing flexibility.
  • Industrial Control: Used in control systems for manufacturing processes, offering precise operation and adaptation to various sensors and actuators.
  • Telecommunications: Integrates into communication infrastructure, supporting complex signal processing tasks necessary for modern telecommunication devices.
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