PIC16C55T-XTE/SS

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Mfr.Part #
PIC16C55T-XTE/SS
Manufacturer
Microchip Technology
Package / Case
28-SSOP (0.209, 5.30mm Width)
Datasheet
Download
Description
IC MCU 8BIT 768B OTP 28SSOP
Stock
49,602
In Stock :
49,602

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Manufacturer :
Microchip Technology
Product Category :
Microcontrollers
Terminal Position :
Dual
Power Supplies :
2.5/6.25V
Packaging :
Tape and Reel (TR)
Series :
PIC® 16C
DMA Channels :
No
RAM Size :
24 x 8
Time@Peak Reflow Temperature-Max (s) :
40
Surface Mount :
yes
Mounting Type :
Surface Mount
Bit Size :
8
Length :
10.2mm
Min Operating Temperature :
-40 °C
RoHS :
Compliant
Frequency :
4MHz
PWM Channels :
No
Memory Size :
512B
Voltage - Supply (Vcc/Vdd) :
3.25V~6V
Max Frequency :
40 MHz
Has ADC :
No
Supplier Device Package :
28-SSOP
ROM (words) :
512
Terminal Finish :
Matte Tin (Sn)
Number of Timers/Counters :
8
Access Time :
4 µs
Peak Reflow Temperature (Cel) :
260
RoHS Status :
ROHS3 Compliant
Watchdog Timer :
yes
EEPROM Size :
-
Memory Type :
EPROM
Package / Case :
28-SSOP (0.209, 5.30mm Width)
Pbfree Code :
yes
Min Supply Voltage :
3.25 V
Number of I/O :
20
Supply Current-Max :
3.3mA
Number of Pins :
28
Published :
2002
Max Operating Temperature :
125 °C
Connectivity :
-
Product Status :
Obsolete
Supply Voltage-Max (Vsup) :
6V
Peripherals :
POR, WDT
CPU Family :
PIC
Number of Terminations :
28
Terminal Form :
Gull wing
Speed :
4MHz
Supply Voltage-Min (Vsup) :
3.25V
Data Bus Width :
8B
Package :
Tape and Reel (TR)
Core Processor :
PIC
Lead Free :
Lead Free
Number of Programmable I/O :
20
Moisture Sensitivity Level (MSL) :
1 (Unlimited)
Core Size :
8-Bit
Operating Temperature :
-40°C~125°C TA
Data Converters :
-
Program Memory Type :
OTP
uPs/uCs/Peripheral ICs Type :
MICROCONTROLLER, RISC
Oscillator Type :
External
Number of I/Os :
20
Base Part Number :
PIC16C55
JESD-609 Code :
e3
Core Architecture :
PIC
Supply Voltage :
5V
Program Memory Size :
768B 512 x 12
Max Power Dissipation :
800mW
Radiation Hardening :
No
Base Product Number :
PIC16C55
DAC Channels :
No
Max Supply Voltage :
6 V
Terminal Pitch :
0.65mm
Pin Count :
28
Datasheets
PIC16C55T-XTE/SS
Introducing Microcontrollers Microchip Technology PIC16C55T-XTE/SS from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Package / Case:28-SSOP (0.209, 5.30mm Width), Number of Pins:28, Number of Terminations:28, Operating Temperature:-40°C~125°C TA, Base Part Number:PIC16C55, PIC16C55T-XTE/SS pinout, PIC16C55T-XTE/SS datasheet PDF, PIC16C55T-XTE/SS amp .Beyond Microcontrollers Microchip Technology PIC16C55T-XTE/SS ,we also offer PIC16F506-I/SL, ATTINY44A-SSN, MS51FB9AE, Our vast inventory has you covered. Contact us now for immediate solutions.

Microchip Technology PIC16C55T-XTE/SS


Microcontrollers Microchip Technology PIC16C55T-XTE/SS Overview

The Microcontrollers Microchip Technology PIC16C55T-XTE/SS is a highly versatile and reliable 8-bit microcontroller unit (MCU) from Microchip Technology, designed to meet the rigorous demands of embedded systems. Engineered to provide a robust blend of performance and efficiency, this MCU features 768 bytes of OTP memory, making it ideal for applications requiring a programmable controller that can be optimized for power and space constraints. The compact 28-SSOP package ensures that it can be integrated into a variety of hardware configurations, facilitating both design flexibility and ease of implementation.

PIC16C55T-XTE/SS Features

  • 8-bit compact microcontroller
  • 768 bytes of OTP memory for reliable data storage
  • Low power consumption suitable for battery-powered applications
  • 28-SSOP package for streamlined integration into diverse systems
  • Durable design suited to demanding operational environments

PIC16C55T-XTE/SS Applications

  • Consumer Electronics: Utilized in smart home devices and personal gadgets where compact size and power efficiency are crucial.
  • Automotive Applications: Deployed in car entertainment and information systems, leveraging its robustness and reliability.
  • Industrial Automation: Serves as a control unit in automated machinery and processes, enhancing operational efficiency and reliability.
  • Telecommunications: Employed in communication infrastructure, providing reliable operations in a compact form factor.
  • Healthcare Devices: Integrated into medical monitoring systems, ensuring accurate and reliable device performance.
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