PI7C8150AMAE-33
- Mfr.Part #
- PI7C8150AMAE-33
- Manufacturer
- Diodes Incorporated
- Package / Case
- 208-BFQFP
- Datasheet
- Download
- Description
- IC INTFACE SPECIALIZED 208FQFP
- Stock
- 42,860
- In Stock :
- 42,860
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- Manufacturer :
- Diodes Incorporated
- Product Category :
- Specialized
- Time@Peak Reflow Temperature-Max (s) :
- 40
- Temperature Grade :
- Other
- Mounting Type :
- Surface Mount
- RoHS Status :
- ROHS3 Compliant
- Supply Voltage :
- 3.3V
- ECCN Code :
- EAR99
- Min Operating Temperature :
- 0°C
- Factory Lead Time :
- 8 Weeks
- Address Bus Width :
- 32
- Terminal Form :
- Gull wing
- Terminal Finish :
- MATTE TIN
- Published :
- 2004
- Number of Pins :
- 208
- Packaging :
- Tray
- Operating Supply Voltage :
- 3.3V
- Max Frequency :
- 33MHz
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- JESD-609 Code :
- e3
- Package / Case :
- 208-BFQFP
- Max Operating Temperature :
- 85°C
- Height Seated (Max) :
- 3.8mm
- Voltage - Supply :
- 3V~3.6V
- Terminal Pitch :
- 0.5mm
- Terminal Position :
- QUAD
- Number of Ports :
- 2
- Number of Terminations :
- 208
- Lead Free :
- Lead Free
- Applications :
- PCI-to-PCI Bridge
- Peak Reflow Temperature (Cel) :
- 245
- Data Bus Width :
- 32b
- uPs/uCs/Peripheral ICs Type :
- BUS CONTROLLER, PCI
- Surface Mount :
- yes
- Radiation Hardening :
- No
- Datasheets
- PI7C8150AMAE-33

Specialized Diodes Incorporated PI7C8150AMAE-33 Overview
The PI7C8150AMAE-33 by Diodes Incorporated stands out as an exemplary IC interface specialized for modern electronic applications, housed in a 208FQFP package. This component is engineered to facilitate reliable and efficient interconnectivity within complex digital systems. The design and implementation of the PI7C8150AMAE-33 ensure that it meets the high standards required by professionals in the electronics field, making it an ideal choice for designers looking to enhance system performance through superior signal integrity and connectivity.
PI7C8150AMAE-33 Features
This IC interface boasts an array of features designed to optimize performance and reliability in demanding environments. It offers robust support for multi-point data transmission with minimal latency, making it highly effective in systems requiring high-speed data handling. Additionally, the component's advanced thermal management capabilities ensure it operates efficiently under a range of temperature conditions.
PI7C8150AMAE-33 Applications
- Data Centers: Enables high-speed data exchange and connectivity between servers, enhancing overall network efficiency.
- Telecommunication Infrastructure: Utilized in telecommunications systems to facilitate rapid data transmission and improved signal integrity across various network nodes.
- Industrial Automation: Critical in automating data communication processes in manufacturing environments, ensuring precision and operational reliability.
- Automotive Systems: Employed in advanced vehicular technologies to support robust communication between in-vehicle networks and sensor arrays.
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