PI3C3306LEX

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Mfr.Part #
PI3C3306LEX
Manufacturer
Diodes Incorporated
Package / Case
8-TSSOP (0.173, 4.40mm Width)
Datasheet
Download
Description
IC BUS SWITCH 1 X 1:1 8TSSOP
Stock
55,541
In Stock :
55,541

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Manufacturer :
Diodes Incorporated
Product Category :
Signal Switches, Multiplexers, Decoders
Type :
Bus Switch
Terminal Position :
Dual
Peak Reflow Temperature (Cel) :
260
Length :
4.4mm
Factory Lead Time :
18 Weeks
Package / Case :
8-TSSOP (0.173, 4.40mm Width)
Contact Plating :
Tin
Number of Ports :
2
Supply Voltage :
3.3V
Operating Temperature :
-40°C~85°C
Voltage Supply Source :
Single Supply
Time@Peak Reflow Temperature-Max (s) :
40
Terminal Form :
Gull wing
Number of Elements :
2
Supply Voltage-Max (Vsup) :
3.63V
ECCN Code :
EAR99
Mounting Type :
Surface Mount
Turn On Delay Time :
9.8 ns
Number of Functions :
2
Resistance :
8Ohm
Number of Terminations :
8
Supply Type :
Single
JESD-609 Code :
e3
Voltage - Supply :
2.3V~3.6V
Radiation Hardening :
No
RoHS Status :
ROHS3 Compliant
Circuit :
1 x 1:1
Mount :
Surface Mount
Propagation Delay :
250 ps
Terminal Pitch :
0.65mm
Polarity :
Non-Inverting
Published :
2016
Number of Bits :
1
Base Part Number :
PI3C3306
Operating Supply Voltage :
3.3V
Number of Pins :
8
Moisture Sensitivity Level (MSL) :
1 (Unlimited)
Logic Function :
Buffer
Width :
3mm
Lead Free :
Lead Free
High Level Output Current :
-120mA
Packaging :
Tape and Reel (TR)
Low Level Output Current :
120mA
Quiescent Current :
500μA
Output Characteristics :
3-STATE
Introducing Signal Switches, Multiplexers, Decoders Diodes Incorporated PI3C3306LEX from Chip IC,where excellence meets affordability. This product stands out with its Type:Bus Switch, Package / Case:8-TSSOP (0.173, 4.40mm Width), Operating Temperature:-40°C~85°C, Mounting Type:Surface Mount, Number of Terminations:8, Circuit:1 x 1:1, Base Part Number:PI3C3306, Number of Pins:8, PI3C3306LEX pinout, PI3C3306LEX datasheet PDF, PI3C3306LEX amp .Beyond Signal Switches, Multiplexers, Decoders Diodes Incorporated PI3C3306LEX ,we also offer 74HCT4514PW,112, SN74CB3T3245PWR, SN74CB3T3125RGYR, Our vast inventory has you covered. Contact us now for immediate solutions.

Diodes Incorporated PI3C3306LEX


Signal Switches, Multiplexers, Decoders - Diodes Incorporated PI3C3306LEX Overview

The PI3C3306LEX, manufactured by Diodes Incorporated, is an integrated circuit bus switch designed for efficient signal switching in various electronic applications. With its compact 8TSSOP package, this IC offers seamless connectivity solutions, making it an ideal choice for modern electronic systems requiring reliable signal routing.

Featuring advanced technology and high-quality construction, the PI3C3306LEX ensures low ON resistance and minimal signal distortion, delivering optimal performance in demanding environments. Its versatile design and robust functionality make it a preferred component for B2B customers seeking high-performance signal switching solutions.

PI3C3306LEX Features

  • Integrated bus switch with 1 x 1:1 configuration
  • Compact 8TSSOP package for space-efficient PCB design
  • Low ON resistance for minimal signal distortion
  • High-speed switching capability for seamless signal routing
  • Wide operating voltage range for compatibility with various electronic systems
  • Robust construction for reliable performance in harsh environments

PI3C3306LEX Applications

  • Automotive Electronics: The PI3C3306LEX can be used in automotive control modules for signal routing in safety systems, entertainment interfaces, and communication networks.
  • Telecommunication Systems: Deployed in telecommunication equipment, this IC facilitates signal switching in routers, switches, and communication interfaces, ensuring smooth data transmission.
  • Industrial Automation: Integrated into industrial control systems, the PI3C3306LEX enables efficient signal routing in PLCs, motor drives, and sensor interfaces, enhancing automation processes.
  • Consumer Electronics: From smart TVs to gaming consoles, this IC optimizes signal switching in consumer electronics devices, providing seamless connectivity and enhanced user experiences.
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