PEX8114-BD13BI G

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Mfr.Part #
PEX8114-BD13BI G
Manufacturer
Broadcom
Package / Case
Datasheet
Download
Description
IC INTERFACE SPECIALIZED 256BGA
Stock
28,387
In Stock :
28,387

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Manufacturer :
Broadcom
Product Category :
Specialized
Published :
2008
Operating Temperature (Max) :
85°C
Terminal Position :
BOTTOM
Qualification Status :
Not Qualified
Surface Mount :
yes
Supply Voltage :
1V
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
JESD-609 Code :
e1
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
Number of Terminations :
256
Temperature Grade :
Industrial
Terminal Finish :
Tin/Silver/Copper (Sn/Ag/Cu)
Bus Compatibility :
ISA; SPI; VGA
Power Supplies :
13.3V
Voltage - Supply :
3.3V
JESD-30 Code :
S-PBGA-B256
Mounting Type :
Surface Mount
Operating Temperature (Min) :
-40°C
Length :
17mm
HTS Code :
8542.31.00.01
RoHS Status :
ROHS3 Compliant
Width :
17mm
Interface :
PCI
Applications :
PCI-to-PCI Bridge
Terminal Form :
Ball
Factory Lead Time :
22 Weeks
Data Transfer Rate-Max :
312.5 MBps
Supplier Device Package :
256-BGA (17x17)
Height Seated (Max) :
1.76mm
Terminal Pitch :
1mm
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Packaging :
Tray
Series :
ExpressLane™
Datasheets
PEX8114-BD13BI G
Introducing Specialized Broadcom PEX8114-BD13BI G from Chip IC,where excellence meets affordability. This product stands out with its Number of Terminations:256, Mounting Type:Surface Mount, PEX8114-BD13BI G pinout, PEX8114-BD13BI G datasheet PDF, PEX8114-BD13BI G amp .Beyond Specialized Broadcom PEX8114-BD13BI G ,we also offer DS90CR285MTDX/NOPB, USB2640I-HZH-02, LTC4316CMS#PBF, Our vast inventory has you covered. Contact us now for immediate solutions.

Broadcom PEX8114-BD13BI G


Specialized Broadcom PEX8114-BD13BI G Overview

The Specialized Broadcom PEX8114-BD13BI G is an integrated circuit designed to offer specialized interface capabilities, encapsulated in a compact 256-ball grid array package. Engineered by Broadcom, a renowned leader in semiconductor solutions, this IC presents unparalleled performance and versatility for various applications in the electronics industry.

With its advanced features and robust design, the PEX8114-BD13BI G caters to the demands of B2B customers seeking high-quality solutions for their integrated circuits requirements. From data centers to industrial automation, this innovative component elevates connectivity and efficiency, ensuring seamless operations and enhanced productivity.

PEX8114-BD13BI G Features

  • Specialized Interface Capabilities: The PEX8114-BD13BI G is equipped with specialized interface features, enabling seamless integration into diverse electronic systems.
  • Compact 256-BGA Package: This integrated circuit is housed in a compact 256-ball grid array package, optimizing space utilization and facilitating efficient PCB layout.
  • High Performance: Broadcom's expertise in semiconductor engineering ensures exceptional performance and reliability, meeting the stringent requirements of modern electronic applications.
  • Versatile Applications: With its versatile design, the PEX8114-BD13BI G is suitable for a wide range of applications, offering flexibility and scalability to meet evolving industry needs.

PEX8114-BD13BI G Applications

  • Data Centers: The PEX8114-BD13BI G enhances connectivity within data center infrastructure, enabling fast and reliable data transmission for servers, storage systems, and networking equipment.
  • By facilitating efficient communication between components, this IC contributes to optimized data processing and improved performance in data center environments.

  • Industrial Automation: In industrial automation systems, the PEX8114-BD13BI G facilitates seamless integration of various devices and sensors, enabling real-time data exchange and control.
  • Its specialized interface capabilities ensure smooth operation and enhanced efficiency in industrial processes, leading to increased productivity and reduced downtime.

  • Networking Equipment: As a key component in networking equipment, the PEX8114-BD13BI G enables high-speed data transmission and reliable connectivity in routers, switches, and gateways.
  • Its compact design and robust performance make it an ideal choice for building scalable and resilient network infrastructure to meet the demands of modern communication networks.

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Shipping Method

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Shipping Cost

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