PEF22552EV1.1-G

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Mfr.Part #
PEF22552EV1.1-G
Manufacturer
Lantiq
Package / Case
160-LBGA
Datasheet
Download
Description
DUALFALC TWO CHANNEL FRAMER AND
Stock
43,009
In Stock :
43,009

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Manufacturer :
Lantiq
Product Category :
Telecom
Power (Watts) :
150mW
Supplier Device Package :
P/PG-LBGA-160-1
Series :
DualFALC™
Base Part Number :
PEF22552
Mounting Type :
Surface Mount
Interface :
E1, J1, SCI, SPI, T1
Number of Circuits :
2
Voltage - Supply :
1.8V 3.3V
Package / Case :
160-LBGA
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Packaging :
Tray
Function :
Framer, Line Interface Unit (LIU)
Operating Temperature :
-40°C~85°C
Datasheets
PEF22552EV1.1-G
Introducing Telecom Lantiq PEF22552EV1.1-G from Chip IC,where excellence meets affordability. This product stands out with its Base Part Number:PEF22552, Mounting Type:Surface Mount, Package / Case:160-LBGA, Operating Temperature:-40°C~85°C, PEF22552EV1.1-G pinout, PEF22552EV1.1-G datasheet PDF, PEF22552EV1.1-G amp .Beyond Telecom Lantiq PEF22552EV1.1-G ,we also offer CPC5712UTR, MT8870DS1, SI32176-C-FM1R, Our vast inventory has you covered. Contact us now for immediate solutions.



PEF22552 Telecom device 2 Circuits

PEF 22552 E V1.1-G Overview


A 160-LBGA package is used to reduce board space requirements.A Tray-packing method is used to pack telecommunications equipment.A Surface Mount-mount is used for mounting the telecom circuit.Telecom circuit is made up of 2 circuits.Providing 1.8V 3.3V wtelecom IC's efficiencyh the correct supply voltage will improve efficiency.A -40°C~85°C-temperature setting offers reliable performance.The PEF22552 base part number can be used to find more related parts.With the DualFALC™ series electronic parts, it can perform similar functions of the telecommunication product .

PEF 22552 E V1.1-G Features


Available in the 160-LBGA package


PEF 22552 E V1.1-G Applications


There are a lot of Infineon Technologies
PEF 22552 E V1.1-G Telecom applications.


  • Fractional T1/E1/J1
  • BITS Timing
  • Digital Access Cross-connect System (DACs)
  • Digital Cross-connect Systems (DCS)
  • Frame Relay Switches and Access Devices (FRADS)
  • ISDN Primary Rate Interfaces (PRA)
  • PBXs channel bank
  • PCM channel bank
  • T3 channelized access concentrators
  • M13 MUX
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